Adhesives

Displaying 131 - 140 of 142

Epoxy adhesive cures as low as 110°C

Epoxy adhesive cures as low as 110°C
  Formulated for disk drive, camera module, optoelectronic and circuit assembly applications, Engineered Material Systems has announced the 535-10M-49 UV cured epoxy adhesive. The material contains a secondary thermal cure initiator that cures as low as 110°C for shadowed areas.
3rd April 2014

Adhesive reliably bonds RFID chips and antennas

Adhesive reliably bonds RFID chips and antennas
Providing reliable transmission of electrical signals, the anisotropic conductive DELOMONOPOX AC245 adhesive has been introduced by DELO Industrial Adhesives. Suitable for the reliable bonding of RFID chips and antennas, it offers high long-term die shear strength and enables efficient production as it can be jetted.
3rd April 2014

Epoxy meets NASA low outgassing specifications

Epoxy meets NASA low outgassing specifications
Suitable for bonding, sealing, coating and encapsulation applications in the aerospace, electronic, optical and optoelectronic industries, EP30-3LO is a two component epoxy system from Master Bond. The epoxy offers optical clarity, high temperature resistance, and meets NASA specifications for low outgassing.
1st April 2014


Optical bonding improves display readability

Optical bonding improves display readability
Believed to be the world's most advanced optical bonding technology, Distec uses the VacuBond high performance silicone optoGel. The manufacturing equipment is capable of directly bonding TFT displays in custom bezels and front housings with integrated protective glass. Moreover, the VacuBond process is reversible: individual components can be recovered, simplifying repairs and reducing repair costs.
27th March 2014

LED Curable System meets USP class VI specifications

Widely used in the manufacture of disposable medical devices, Master Bond's LED403Med is a single component system that passes the plastics test for USP Class VI and ISO 10993-5 cytotoxicity requirements. This medical grade system withstands sterilization methods such as gamma radiation, EtO and various chemical sterilants.
10th March 2014

Abrasion resistant epoxy delivers Shore D hardness exceeding 95

Delivering abrasion resistance for an array of chemical and mechanical processing applications, the EP21SC-1 is a 2 component epoxy from Master Bond.
18th February 2014

Optical display adhesives provide invisible bonds

Optical display adhesives provide invisible bonds
Intertronics announce the Dymax light-curable optical display bonding adhesives. These one-part LCD adhesives are designed for touch panel assembly including bonding flat panel displays, LCD screens, tablets, outdoor kiosks, navigation systems, liquid crystal displays, kiosk panels, mobile phones, and smart connected devices.
13th February 2014

Engineered Material Systems Low-Temperature Cure/Snap Cure Conductive Adhesive

Engineered Material Systems Low-Temperature Cure/Snap Cure Conductive Adhesive
Engineered Material Systems introduces the CA-180 Low Temperature Cure/Snap Cure Conductive Adhesive designed for die-attach applications in smart cards, circuit assembly, photonics or camera modules.
12th February 2014

Non-conductive paste designed for flip chip packaging

Non-conductive paste designed for flip chip packaging
  Designed specifically to provide high reliability to the gold stud bump interconnects used in flip chip packaging, the 585-1 Non-Conductive Paste (NCP) has been introduced by Engineered Material Systems.
30th January 2014

Microcapsules In Adhesive Dispensing Technology

These days, we can find microcapsules in almost every industrial sector, where they take numerous roles. However, dispensing these fragile materials can be a problem since clearly it is important that the microcapsules be undamaged by the dispensing process. In adhesive technology, microcapsules can fulfil several functions. For example, microcapsules may be an integral part of the control of reaction and curing processes. Some anaerobic “threadlocking” adhesives contain microcapsules.
15th January 2013


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