Adhesives

Displaying 131 - 135 of 135

Engineered Material Systems Low-Temperature Cure/Snap Cure Conductive Adhesive

Engineered Material Systems Low-Temperature Cure/Snap Cure Conductive Adhesive
Engineered Material Systems introduces the CA-180 Low Temperature Cure/Snap Cure Conductive Adhesive designed for die-attach applications in smart cards, circuit assembly, photonics or camera modules.
12th February 2014

Non-conductive paste designed for flip chip packaging

Non-conductive paste designed for flip chip packaging
  Designed specifically to provide high reliability to the gold stud bump interconnects used in flip chip packaging, the 585-1 Non-Conductive Paste (NCP) has been introduced by Engineered Material Systems.
30th January 2014

Microcapsules In Adhesive Dispensing Technology

These days, we can find microcapsules in almost every industrial sector, where they take numerous roles. However, dispensing these fragile materials can be a problem since clearly it is important that the microcapsules be undamaged by the dispensing process. In adhesive technology, microcapsules can fulfil several functions. For example, microcapsules may be an integral part of the control of reaction and curing processes. Some anaerobic “threadlocking” adhesives contain microcapsules.
15th January 2013


Biodegradable Contact Cleaning Adhesive Roll from Teknek

Following on from the successful introduction of EcoFilm adhesive rolls, Teknek has today announced the introduction of another market leading innovation with its new Biodegradable “EcoPaper” adhesive roll. The Teknek contact cleaning process uses sheeted adhesive rolls, which once consumed, have to be disposed of.
23rd August 2012

Epoxy Manufacturer Releases a Strong Fiber Reinforced Epoxy Resin

Comprised of an aramid fiber reinforced epoxy adhesive for high performance structural bonding, Master Bond's EP30R features outstanding dimensional stability and enhanced impact resistance. This two part epoxy is formulated to cure at room temperature or more rapidly at elevated temperatures.
18th January 2010


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