Component Management

Adhesive tape allows fast ambient temperature assembly

24th October 2014
Siobhan O'Gorman
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The Bond-Ply 800, a thermally conductive pressure-sensitive adhesive tape, which cures in ambient temperatures to allow fast and efficient assembly without the need for mechanical fasteners or high-temperature curing, has been released by Bergquist.

 

Suitable for attaching heat spreaders or heatsinks to assemblies such as LED light engines, motor controllers, power converters, or high-performance processors, the Bond-Ply 800 has the highest thermal conductivity of the Bond-Ply range, at 0.8W/m-K. The double-sided tape, which is tough, easy and quick to use in a production environment, features a fibreglass carrier. With thermal impedance of 0.60°C-in2/W (at 50psi), the acrylic adhesive delivers efficient heat-transfer. The adhesive tape, ensures high bond strength, providing reliability.

Reducing labour and materials costs, the tape is available in sheet form, roll form, or as die-cut parts. The adhesive tape also increases throughput by removing the time needed to attach mechanical fasteners or go through high-temperature curing. The tape is offered in two standard thicknesses, which have low CTE and high tensile strength. Ensuring robust electrical isolation, the 0.127 and 0.203mm versions offer dielectric breakdown voltages of 4000 or 6000V, respectively.

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