Component Management
Conductive adhesive for small to medium size chip bonding
Engineered Materials Systems has announced a fast cure conductive adhesive for die attach applications with small to medium size die. Called EMS 561-338, it is designed to cure in less than one minute at 150ºC.
The adhesive is stress-absorbing to withstand the rigors of thermal cycling and is said to feature excellent conductive stability. The material can be applied by stencil printing or needle dispensing.
Product Spotlight
APV1111GVY
Panasonic
Panasonic PhotoMOS® Photovoltaic MOSFET High-Power Drivers
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| Stock: | 3490 |
| Cost: | $3.95 |
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