Zestron plans to clean up at SMT Hybrid Packaging

4th May 2017
Posted By : Peter Smith
Zestron plans to clean up at SMT Hybrid Packaging

At SMT Hybrid Packaging 2017, ZESTRON plans to feature cleaning agents as well as  cleaning machines from leading manufacturers.  Attendees will have the opportunity to learn more about different innovative cleaning technologies surrounding PCB and stencil cleaning applications.  ZESTRON’s team of process engineers as well as representatives of cleaning equipment manufacturers will be available to answer questions regarding cleaning equipment and compatible cleaning mediums.

ZESTRON will highlight two of its newest innovative products, VIGON N 640 and HYDRON SC 300.  VIGON N 640, specifically developed for PCB cleaning, is a pH neutral cleaning agent that provides excellent cleaning performance on the latest pastes and fluxes and is optimized for use in specific spray-in-air batch machines.  HYDRON SC 300 is a single-phase cleaning agent designed to reliably remove SMT adhesives without leaving streaks after drying.


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