Indium Corporation’s Senior Research Metallurgist, Jie Geng, PhD., will conduct a webinar on low-voiding, high-reliability, lead-free solder paste for automotive applications.

Indium Corporation’s Senior Global Product Manager for Semiconductor and Advanced Materials, Sze Pei Lim, is scheduled to present at the International Conference on Electronics Packaging (ICEP Japan 2024).

Indium Corporation, a global pioneer in materials science and electronics assembly solutions, commemorates its 90th anniversary on 13 March 2024.

Indium Corporation features its innovative Durafuse solder technology alongside its Rel-ion portfolio of proven electrical, mechanical, and thermal solutions for EV manufacturing, at IPC APEX EXPO 2024, 9–11 April 2024, in Anaheim, California, US.

Indium Corporation will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 20th International Conference and Exhibition on Device Packaging hosted by IMAPS, 18–21 March 2024, in Fountain Hills, AZ.

Indium Corporation is set to present three insightful contributions at APEC 2024, taking place from 25-29 February in Long Beach, CA. These presentations, delivered by distinguished members of the Indium Corporation team, will delve into various aspects of the power electronics assembly industry.

At the upcoming APEC 2024, taking place from 25-29 February in Long Beach, California, Indium Corporation is set to exhibit a range of its high-reliability materials designed for automotive and power electronics applications, including those used in electric vehicle manufacturing.

Indium Corporation will showcase its advanced assembly materials for power electronics, including the rapidly evolving EV manufacturing and e-Mobility market, at NEPCON Japan, January 24-26, in Tokyo, Japan.

Indium Corporation will showcase its high-reliability, gold-based precision die-attach (PDA) preforms for critical laser and RF applications at SPIE Photonics West, taking place from January 27th February 1st in San Francisco. 

Indium Corporation Senior Area Technical Manager Jason Chou is set to deliver a presentation at the Power Device & Module Expo, held in conjunction with NEPCON Japan, on January 24th in Tokyo.

Indium Corporation’s Principal Engineer – Advanced Materials, Andy C. Mackie, PhD., will conduct a webinar on the rapid advancements taking place within e-mobility electronics technology.

Indium Corporation is proud to announce the addition of Sales Engineer Meik Fratzel to its European team.

Indium Corporation will showcase a new solder preform technology at Productronica 2023 from the 14th to the 17th November in Munich, Germany.

Indium Corporation will showcase its advanced assembly materials for PCBA and power electronics, including those for the rapidly evolving electric vehicle manufacturing and e-Mobility market, at Productronica, November 14-17, in Munich, Germany.

Solder Chemistry will feature two of its proven solder paste solutions at Productronica, 14th – 17th November in Munich, Germany.

Indium Corporation has announced the acquisition of SAFI-Tech to advance low-temperature soldering technology.

Indium Corporation is proud to showcase its products and expertise for the rapidly evolving EV manufacturing and e-Mobility market at productronica India, 13th – 15th September, in Bengalaru.

Indium will showcase selections from its portfolio of proven products for thermal management and power electronics applications at SEMICON Taiwan, 6—8 September 2023, in Taipei.

Indium Corporation is set to deliver a technical presentation and exhibit its products for power electronics assembly at PCIM Asia, 29th – 31st August in Shanghai, China.

Indium Corporation has earned the IEEE Malaysia Section Outstanding Industry Award (Innovation) for its InFORMS brand of reinforced solder preforms.