Component Manufacturing

Displaying 1 - 10 of 115

Method offers easier nanoscale manufacturing

Method offers easier nanoscale manufacturing
Scientists at the University of Chicago and Argonne National Laboratory have discovered a new way to precisely pattern nanomaterials that could open a new path to the next generation of everyday electronic devices. The new research, published in Science, is expected to make such materials easily available for eventual use in everything from LED displays to cellular phones to photodetectors and solar cells.
28th July 2017

Whitepaper reveals how to optimise part mark verification

Whitepaper reveals how to optimise part mark verification
In a new whitepaper from Pryor, it is revealed how manufacturers can verify the quality of part marks to optimise inventory control and asset tracking processes. With inventory control and asset tracking more important than ever across the manufacturing sectors, the marking, identification and traceability specialist Pryor has published a free whitepaper, which explains how manufacturers can better verify the quality of part marks.
13th July 2017

Soak booster option cuts cost of test

Soak booster option cuts cost of test
An enhanced Soak Booster option has been added to Multitest’s MT9928 tri-temp handler. It cuts down the soak time by up to 50%. With this development Multitest is responding to the market need for temperature testing of large devices where soak time closely correlates with throughput, and as a result, impacts the cost of test.
13th July 2017


Structural bonders create opportunities in maintenance and repair

Structural bonders create opportunities in maintenance and repair
The latest introduction from Henkel is another milestone for its LOCTITE brand. The company has developed a new range of Universal Structural Bonders whose many attributes have been achieved through new, patented hybrid technology. This innovative approach substantially extends the application scope of these adhesives which also afford improved health and safety benefits.
20th June 2017

Centrifugal disk finishing for thin parts etc

Centrifugal disk finishing for thin parts etc
With the option of “gap rinsing”, the new Turbotron centrifugal disk finishing machines from Walther Trowal are ideal for finishing extremely thin fine-blanked parts. The new machines lower the investment expenditures and offer high uptimes.  Walther Trowal is said to be the first supplier of mass finishing equipment who brings a new line of TT centrifugal disk finishing machines to the market with spinner and wear ring completely made from polyurethane and a rinsing system for the gap between spinner and stationary work bowl.    
21st May 2017

Substrate & micro assembly at IMS 2017

NEO Tech will showcase its high-reliability substrate and microelectronic assembly capabilities at the 2017 International Microwave Symposium - June 6-8 - at the Hawaii Convention Center in Honolulu.
4th May 2017

Report examines the latest in packaging technologies

Report examines the latest in packaging technologies
As the development of packaging technologies intensifies, in order to accommodate further front-end scaling trends and multi-die integration, advanced FO RDL and FC substrates represent the key interconnect components. The competition between FO and FC packages and the features of their interconnect components is resulting in an abundance of new package architectures that are crucial in enabling future products and markets.
20th April 2017

Bonding technique uses inkjet printers

Bonding technique uses inkjet printers
A team of Spanish researchers at the University of Barcelona have demonstrated a bonding technique for chips, called SMD or surface mounted devices, that uses an inkjet printer with ink that incorporates silver nanoparticles. The technique, described in the Journal of Applied Physics, was developed in response to the industrial necessity for a fast, reliable and simple manufacturing process, and with an eye to reducing the environmental impact of the standard fabrication processes.
15th March 2017

Conquering metal fatigue

Conquering metal fatigue
Metal fatigue can lead to abrupt and sometimes catastrophic failures in parts that undergo repeated loading, or stress. It’s a major cause of failure in structural components of everything from aircraft and spacecraft to bridges and powerplants. As a result, such structures are typically built with wide safety margins that add to costs. Now, a team of researchers at MIT and in Japan and Germany has found a way to greatly reduce the effects of fatigue by incorporating a laminated nanostructure into the steel.
10th March 2017

Curing epoxy features low thermal resistance

Formulated for use in demanding thermal management applications, Master Bond EP30TC is a two component epoxy that contains a robust thermally conductive filler with very fine particle sizes. This NASA low outgassing certified system can be used for bonding, coating, sealing and encapsulating for the aerospace, electronic, optical and OEM industries.
31st January 2017


Component Manufacturing documents


Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

Motek 2017
9th October 2017
Germany Stuttgart