Component Manufacturing

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Process technology options for wearable device displays

Process technology options for wearable device displays
Manufacturer of laser welding equipment and systems, AMADA MIYACHI EUROPE, has announced the availability of several process technology options for interconnection of flexible materials used in manufacturing wearable technology devices. Available process technologies include hot bar reflow soldering, heat staking, ACF laminating/pre-bonding, and heat-seal/ACF final bonding.
9th October 2017

Resistance welding and laser marking equipment at The Battery Show 2017

AMADA MIYACHI is to highlight resistance welding and laser marking equipment for battery manufacturing applications at The Battery Show, to be held September 12-14, 2017, in Novi, Michigan. On display will be the LMWS workstation paired with the LMF70-HP pulsed fiber laser for welding, LMWS paired with the LMF20 for marking and engraving, and the DC29 linear DC spot welding control with an 88A/EZ THIN-LINE series parallel gap weld head for spot welding.
8th September 2017

Method offers easier nanoscale manufacturing

Method offers easier nanoscale manufacturing
Scientists at the University of Chicago and Argonne National Laboratory have discovered a new way to precisely pattern nanomaterials that could open a new path to the next generation of everyday electronic devices. The new research, published in Science, is expected to make such materials easily available for eventual use in everything from LED displays to cellular phones to photodetectors and solar cells.
28th July 2017


Whitepaper reveals how to optimise part mark verification

Whitepaper reveals how to optimise part mark verification
In a new whitepaper from Pryor, it is revealed how manufacturers can verify the quality of part marks to optimise inventory control and asset tracking processes. With inventory control and asset tracking more important than ever across the manufacturing sectors, the marking, identification and traceability specialist Pryor has published a free whitepaper, which explains how manufacturers can better verify the quality of part marks.
13th July 2017

Soak booster option cuts cost of test

Soak booster option cuts cost of test
An enhanced Soak Booster option has been added to Multitest’s MT9928 tri-temp handler. It cuts down the soak time by up to 50%. With this development Multitest is responding to the market need for temperature testing of large devices where soak time closely correlates with throughput, and as a result, impacts the cost of test.
13th July 2017

Structural bonders create opportunities in maintenance and repair

Structural bonders create opportunities in maintenance and repair
The latest introduction from Henkel is another milestone for its LOCTITE brand. The company has developed a new range of Universal Structural Bonders whose many attributes have been achieved through new, patented hybrid technology. This innovative approach substantially extends the application scope of these adhesives which also afford improved health and safety benefits.
20th June 2017

Centrifugal disk finishing for thin parts etc

Centrifugal disk finishing for thin parts etc
With the option of “gap rinsing”, the new Turbotron centrifugal disk finishing machines from Walther Trowal are ideal for finishing extremely thin fine-blanked parts. The new machines lower the investment expenditures and offer high uptimes.  Walther Trowal is said to be the first supplier of mass finishing equipment who brings a new line of TT centrifugal disk finishing machines to the market with spinner and wear ring completely made from polyurethane and a rinsing system for the gap between spinner and stationary work bowl.    
21st May 2017

Substrate & micro assembly at IMS 2017

NEO Tech will showcase its high-reliability substrate and microelectronic assembly capabilities at the 2017 International Microwave Symposium - June 6-8 - at the Hawaii Convention Center in Honolulu.
4th May 2017

Report examines the latest in packaging technologies

Report examines the latest in packaging technologies
As the development of packaging technologies intensifies, in order to accommodate further front-end scaling trends and multi-die integration, advanced FO RDL and FC substrates represent the key interconnect components. The competition between FO and FC packages and the features of their interconnect components is resulting in an abundance of new package architectures that are crucial in enabling future products and markets.
20th April 2017

Bonding technique uses inkjet printers

Bonding technique uses inkjet printers
A team of Spanish researchers at the University of Barcelona have demonstrated a bonding technique for chips, called SMD or surface mounted devices, that uses an inkjet printer with ink that incorporates silver nanoparticles. The technique, described in the Journal of Applied Physics, was developed in response to the industrial necessity for a fast, reliable and simple manufacturing process, and with an eye to reducing the environmental impact of the standard fabrication processes.
15th March 2017


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