Component Manufacturing

Displaying 111 - 115 of 115

Infineon Completes 300-Millimeter Thin-Wafer Production Qualification

Infineon Technologies has achieved a major breakthrough in the manufacturing of power semiconductors on 300-millimeter thin wafers. In February, the company received the first customer go-aheads for products of the CoolMOS family produced by the 300-millimeter line at the Villach (Austria) site. The production process based on the new technology has completed qualification from start to finish and customers have given the go-ahead.
19th February 2013

FleX Silicon-on-Polymer Available With TowerJazz Foundry CMOS

American Semiconductor announces TowerJazz is the first foundry with a CMOS process, CS18, available for physically flexible wafers and ICs utilizing FleX Silicon-on-Polymer. This announcement was made at the 12th annual Flexible & Printed Electronics Conference presented by the FlexTech Alliance held in Phoenix, Arizona on January 29 - February 1, 2013.
31st January 2013

Essemtec’s Tower Increases Variosystems Flexibility of Production

Essemtec’s Tower Increases Variosystems Flexibility of Production
Essemtec AG announces that its Tower Automatic Storage System simplifies logistics and increases the flexibility of production for Variosystems, an international electronics manufacturing subcontractor. Variosystems manages thousands of components for its customers’ assembly jobs. Until recently, the component storage has required significant effort. Now, with Essemtec’s Tucano, component reels and trays can be stored locally in production.
1st March 2011


Essemtec Builds Printer For 180x50cm

Essemtec Builds Printer For 180x50cm
Essemtec will build a production line for LED tubular lamps that will replace the common fluorescent lamps. Essemtec's innovation, a 180x50cm printing system will enable the full automatic, inline production of such lamps.
24th February 2011

Rochester Electronics Expands its Space-Level Manufacturing Services

Rochester Electronics has expanded its space-level continuing manufacturing services and product offering to provide a continuous, long-term source of certified semiconductor devices. Since many manufacturers are discontinuing production of space-level parts due to the rigorous certification processes and expansive infrastructure required to manufacture, test, and store these low-volume parts, customers are often left with few places to turn for authorized space-level solutions.
17th November 2010


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Motek 2017
9th October 2017
Germany Stuttgart