Component Manufacturing

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Efficient production at any batch size

Efficient production at any batch size
  B&R presented the SuperTrak industrial transport system at the SPS IPC Drives trade fair. Other highlights included a multitude of mapp components and connected manufacturing solutions based on OPC UA communication.
1st December 2016

Advantageous alternative technology in vertical dryer

Advantageous alternative technology in vertical dryer
A new solution from De Dietrich Process Systems has added benefits for the drying of powders in process industries, cosmetics and food. The Guedu vertical dryers have been installed by several manufacturers, and resulted in productivity improvements. The short cycle times have also reduced handling.
13th October 2016

E-beam lithography system to feature at Vienna show

The F7000 EB (electron beam) lithography system will be the centerepice of Advantest’s stand at the Micro and Nano Engineering Show in Vienna (September 19-23). The system delivers high throughput and creates very accurate and smooth nano-patterns on wafers from 1X-nm resolutions.
19th September 2016


Laser direct structuring cuts cost of custom sensors

Laser direct structuring cuts cost of custom sensors
The latest development for PEWATRON’s customer-specific PLDS pressure sensors is based on advanced Laser Direct Structuring (LDS) technology. LDS has already been used to create innovative new solutions in various areas of the automotive sector and is now revolutionising the sensor industry as well.
6th September 2016

Renesas and TSMC collaborate for next-gen automotive MCUs

Renesas Electronics and TSMC have announced that they are collaborating on 28nm eFlash process technology for manufacturing MCUs targeted at next-gen green and autonomous vehicles. The automotive MCUs employing this new 28nm process technology are slated for sample shipment and mass production in 2017 and 2020, respectively.
1st September 2016

Thermal management for semiconductor process equipment

Thermal management for semiconductor process equipment
The critical production tools used in semiconductor fabrication facilities must be reliable and easy to service in order to minimise downtime. Laird has developed custom cooling and temperature control systems, including heat exchangers, pumps, sensors, thermoelectric modules, thermoelectric assemblies, thermoelectric chillers, compressors, flow controllers and temperature controllers, to keep semiconductor fabrication equipment running at precise temperatures.
24th August 2016

Mitsubishi signs up to AFRC test facility for metal components

Mitsubishi signs up to AFRC test facility for metal components
Mitsubishi Materials Group has signed up to be the latest member of the University of Strathclyde’s Advanced Forming Research Centre (AFRC), part of the High Value Manufacturing Catapult. The AFRC will act as a test facility for the development of new products and manufacturing processes, which will be used to produce metal components for use in a range of industries – including oil and gas, aerospace and automotive.
15th August 2016

A personal touch: the new standard for customer service in electronics

A personal touch: the new standard for customer service in electronics
It wasn’t that long ago that industrial and consumer product manufacturing were on two separate ends of the scale. But in today’s world, choice for consumers has started to drive industrial expectation because at the end of the day, everyone is a consumer - even designers, engineers and specifiers. By Pete Cross, MD, Corintech.
11th August 2016

Continuous improvement in surface-mount assembly and the pathway to smart manufacturing

Continuous improvement in surface-mount assembly and the pathway to smart manufacturing
Data structures and software tools developed to enable continuous improvement of surface-mount assembly productivity now create a stepping stone that can help OEms and CEMs make the transition into smart manufacturing. This comprehensive report from Yamaha Motor IM explains all.
12th July 2016

Amkor opens MEMS packaging line in China

Driven by the increase in global demand for sensors from the smartphone and automotive markets, Amkor Technology just announced it is opening a new MEMS and sensor packaging line at its facility in Shanghai. This new, state-of-the-art line will build on the expertise developed at Amkor’s MEMS packaging line in the Philippines, which has produced more than 2.1 billion units of MEMS and sensors since 2011.
2nd July 2016


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26th June 2017
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11th September 2017
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