Essemtec plans to exhibit at IMAPS Pasadena and will demonstrate its compact Spider jet dispenser which can utilize two dispensing valves rated at up to 150,000 dots per hour. It dispenses 3D patterns and is easily adapted to an application.
The Spider occupies only 1 m² of floor space and features linear motor drives for high accuracy: 40 µm (3σ) at full speed. Job changeover is quick with intuitive CAD import and job preparation. Mapping of heights by laser technology enables 3D applications. A mineral-cast chassis provides stability at varying temperatures. Job and quality management is integrated. An optional ISO 7 cleanroom version is available.
The Spider is capable of a variety of semiconductor packaging applications including underfill for flip chip, dam and fill chip encapsulation, glob top and cavity fill, die bonding, lid seal, thermo-compression bonding, thermal grease, 2.5/3D packaging, and copper pillar packaging.