Events

Displaying 371 - 380 of 399

GIL 2014: Europe to focus on future of factories

The evolution of future factories under the paradigm of industry 4.0 will be will be discussed at the annual Frost & Sullivan’s event GIL 2014: Europe, to be held in London on Wednesday 14th May at the Royal Garden Hotel in Kensington. For the sixth consecutive year, GIL 2014: Europe will gather together top opinion leader across different industries.
4th April 2014

Belden demo Industry 4.0 at Hanover Fair

At this year's Hanover Fair, April 7-11, Belden will showcase its range of world-class networking, cabling and connectivity solutions for mission critical applications in alternative energy, safe railway transport systems and reliable energy-efficient data centre management, as well as solutions for wireless networking and connectivity.
21st March 2014

Jetting, dispensing and conformal coating systems at APEX

Jetting, dispensing and conformal coating systems at APEX
At IPC APEX 2014, March 25-27, 2014 in Las Vegas, USA, Nordson ASYMTEK will be exhibiting new jetting, dispensing and conformal coating systems. SMT adhesive dot jetting with dual action will be demonstrated on Nordson ASYMTEK's latest system, the Quantum Series high-performance large-format dispenser.
20th March 2014


Special topics at SMT Hybrid Packaging

Special topics at SMT Hybrid Packaging
The SMT Hybrid Packaging International Exhibition and Conference for System Integration in Micro Electronics, Nuremberg, 6-8 May 2014, will feature several special topics presented with their own exhibition areas. The production line of the Fraunhofer IZM in Hall 6 will be dedicated to "Industry 4.0 - With new Technologies towards lot size 1".
19th March 2014

Conference explores industrial manufacture of GaN epiwafers

EpiGaN announced that Dr. Marianne Germain, CEO and co-Founder, will deliver a presentation at the CS International Conference 2014 in Frankfurt, Germany. Entitled “Industrial manufacturing of GaN epiwafers for High Voltage and RF markets”, the presentation will detail how an industrial material source of GaN epiwafers, truly enabling expected device performance, is required, as the GaN electronics market is predicted to significantly ramp-up in the coming years.
18th March 2014

SMT pick-and-place system to be exhibited at Automaticon 2014

At the upcoming AUTOMATICON exhibition, taking place March 25 - 28 in Warsaw,Essemtec Poland will exhibit its Pantera XVC entry level SMT pick-and-place system in booth B28, hall 1. The Pantera-XVC, an entry level SMT pick-and-place system that ideally meets the standards of a high-mix/low-volume production. 
11th March 2014

PCB end mills deliver lasting & predictable wear patterns

PCB end mills deliver lasting & predictable wear patterns
Making its exhibition debut at JEC Europe 2014 (Paris, 11-13 March), CoroMill Plura range of brazed PCD end mills is likely to be of great interest to any manufacturers performing edging, surface milling, slotting or cutting operations on CFRP components.
11th March 2014

Workshop reveals the potential value of nanocomposites

The Nanotechnology Knowledge Transfer Network has published findings and recommendations from its Graphene and Nanofillers for Composites Workshop held in December 2013 in a report co-authored by the National Composites Centre, Materials KTN, and Cambridge Nanomaterials Technology.  
11th March 2014

Balver Zinn showcase solder paste technology at APEX

Balver Zinn showcase solder paste technology at APEX
At the IPC APEX EXPO, March 25-27 in Las Vegas, USA, the Balver Zinn Group will exhibit in Booth #2714. Balver Zinn and Cobar company representatives will be on hand to display the company’s OT2 and WW50 solder paste along with the latest solder wire and flux technologies and services.
4th March 2014

Aqueous solution protects solder joints from chemical attack

Aqueous solution protects solder joints from chemical attack
At SMTA Dallas, March 4 in Plano, Texas, and SMTA Houston, March 6 in Stafford, Texas, Kyzen will exhibit the AQUANOX A4639 electronic assembly aqueous solution. Effective on B-side misprints, the A4639 biodegradable aqueous solution protects solder joints from chemical attacks and does not contain CFCs or HAPs.
4th March 2014


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