Engineered Materials Systems (EMS) has announced that it will showcase its DF-3000 series negative film photoresists during SEMI MEMS 2015, 17th to 18th September 2015 at the AtaHotel in Milan, Italy.
The DF-3000 series is available in various thickness formats from 5 to 50µm, ±5%. The cured chemistry can withstand harsh environments including resistance to extreme moisture conditions and corrosive chemicals. The DF-3000 series films are tougher (less brittle) than most negative photo resists on the market with a glass transition temperature of 158°C (By DMA Tan Delta) and a moderate modulus of 3.5GPa at 25°C. It is hydrophobic in nature, offering chemical and moisture resistance. DF-3000 series films are compatible with and can be used in contact with the EMS line of spin coatable photoresists.
Company representatives will be available at the show to discuss the company’s full line of negative photoresists as well as conductive and non-conductive adhesives for semiconductor and circuit assembly applications.