Nordson DAGE, Nordson MATRIX and Nordson YESTECH, divisions of Nordson Corporation will be exhibiting at the SMT/Hybrid/Packaging exhibition in Nuremberg (May 16-18). Nordson DAGE will demonstrate their flagship system – the new Quadra 7 with 0.1μm sub-micron feature recognition which comes equipped with two 4K UHD displays and 8 million pixels to fully show the 50μm pixel pitch and 6.7MP image size of the Aspire FP detector.
The Quadra 5 offers high performance and ease of use for 2D and 3D X-ray applications. 0.35μm feature recognition up to 10W of power, makes the Quadra 5 ideal for printed circuit board and semiconductor package inspection.
Nordson MATRIX complements its existing application spectrum of SMT and PTH solder joint inspection with power hybrid applications (e.g. IGBT), battery inspection and wire bond testing.
By focusing on these applications Matrix is answering increased demand for more safety and quality inspection of consumer products like smartphones or earphones.
The configuration of its inline systems offers maximum possibilities to adapt to customer specific needs as one can choose between different inspection technologies (2D Transmission, SFT, 2.5D Off-Axis, 3D SART) depending on the actual inspection demand.
The Nordson YESTECH FX-940 ULTRA 3D AOI boasts cutting-edge 3D technology and it can be used for the inspection of solder defects, lead defects/lifted leads, component presence and co-planarity of chips, BGAs and other height sensitive devices.