Solder alloy fabrications to be showcased at NEPCON China

20th June 2017
Posted By : Lanna Cooper
Solder alloy fabrications to be showcased at NEPCON China

 

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS, at NEPCON South China 2017 29th-31th August in Shenzhen, China.

Indium Corporation is redefining solder with its InFORMS solder preforms. InFORMS are a composite preform consisting of solder and a reinforcing matrix. Together, lateral strength is increased and bondline co-planarity is improved. In addition, superior thermal cycling reliability can be achieved. 

When InFORMS were used to solder a DBC to the baseplate of an IGBT, one study showed:

  • Four improved thermal cycling reliability compared to a solder preform-only approach
  • Two improved thermal cycling reliability compared to a solder preform + Al wirebond stitch approach
  • Reduced voiding (<1%)
  • Lower cost of ownership – as a drop-in replacement for a standard preform or solder paste, InFORMS require no additional process steps or equipment

Click here for more information about InFORMS.


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