Solder alloy fabrications to be showcased at NEPCON China

Indium Corporation is redefining solder with its InFORMS solder preforms. InFORMS are a composite preform consisting of solder and a reinforcing matrix. Together, lateral strength is increased and bondline co-planarity is improved. In addition, superior thermal cycling reliability can be achieved. 

When InFORMS were used to solder a DBC to the baseplate of an IGBT, one study showed:

• Four improved thermal cycling reliability compared to a solder preform-only approach
• Two improved thermal cycling reliability compared to a solder preform + Al wirebond stitch approach
• Reduced voiding (<1%)
• Lower cost of ownership – as a drop-in replacement for a standard preform or solder paste, InFORMS require no additional process steps or equipment

Click here for more information about InFORMS.