Inspection & Test

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AI chip to speed predictive maintenance in smart factories

AI chip to speed predictive maintenance in smart factories
ROHM Semiconductor and A*STAR’s Institute of Microelectronics (IME), a renowned research institute under the Agency for Science, Technology and Research (A*STAR), recently announced the joint development of an artificial intelligence (AI) chip to boost efficiency in predictive maintenance for smart factories.
23rd June 2017

Mixed-signal channel card aids IoT device testing

A high-resolution, highly accurate mixed-signal channel card has been added to its Wave Scale MX product family by Advantest. It extends the series range in testing analogue-to-digital and digital-to-analogue waveform converters. The Wave Scale MX high-resolution card combines high parallel testing capability with reliable AC and DC performance.
22nd June 2017

Molecular thermometer provides contactless measurement

Molecular thermometer provides contactless measurement
Chemists at Johannes Gutenberg University Mainz (JGU) in cooperation with researchers of the German Federal Institute for Materials Research and Testing (BAM) in Berlin have developed a molecular thermometer. The gemstone ruby served as the source of inspiration. However, the thermometer developed by the team headed by Professor Katja Heinze at the JGU Institute of Inorganic Chemistry and Analytical Chemistry is a water-soluble molecule, not an insoluble solid.
14th June 2017


JTAG/Boundary scan controller uses embedded instruments

JTAG/Boundary scan controller uses embedded instruments
SCANFLEX II CUBE is the latest generation of modular JTAG/Boundary Scan controllers developed by GOEPEL electronic.. Based on the latest multi-core processors and FPGAs, SCANFLEX II CUBE opens new ways for the Embedded JTAG Solutions. This test and validation method uses embedded instruments to test and program complex boards.
12th June 2017

Versatile rework system

PDR has launched an enhanced rework station. The IR-E3G Gold is said to be ideal for a wide range of SMD/BGA/microBGA/CSP/LED applications on small-large sized PCBs. The IR-E3G is said to add superior thermal control and twin cameras for precision alignment and process observation. 
31st May 2017

Pre-bond testing development hikes 3D chip yields

Pre-bond testing development hikes 3D chip yields
A fully-automatic system for pre-bond testing of advanced 3D chips has been developed by Imec, the research and innovation hub in nano-electronics and digital technologies, and Cascade Microtech, a leader in advanced wafer-probe solutions. The successful development of Pre-bond testing is important to increase the yield of 3D stacked chips.
30th May 2017

Rack-based configurations lower cost of automated test

Rack-based configurations lower cost of automated test
ATE Core Configurations which deliver core mechanical, power and safety infrastructure to help users accelerate the design and build of automated test systems have been introduced by NI. They target industries ranging from semiconductor and consumer electronics to aerospace and automotive.
29th May 2017

Video measuring ups quality of PCBs

Video measuring ups quality of PCBs
A Nikon Metrology video measuring machine has improved quality control of PCBs at Stevenage Circuits Limited (SCL). The new Nikon iNEXIV VMA4540 is used virtually continuously for 2-D optical coordinate measurement of machined features and copper tracks. It underpins not only first article inspection of boards and printed reports for customers, but also process control in the drilling, etching and routing departments.
23rd May 2017

Ersa at the ICSR

Ersa at the ICSR
Kurtz Ersa North America will exhibit with Comtree at the International Conference on Soldering and Reliability (ICSR) (June 6-8). Ersa’s exclusive representative in Canada, Comtree will highlight some of Ersa’s rework systems, including the HR 550 hybrid rework system and the Smartflow 2020 selective solder system. 
13th May 2017

3D System allows evaluation of complicated shapes and components

3D System allows evaluation of complicated shapes and components
With its EyeVision 3D, EVT offers a multifunctional software solution, which in the field of 3D can solve a broad spectrum of tasks like so called “bin-picking”.The evaluation of the EyeVision 3D software using a depth image, which then can be used to operate a robot gripper. Furthermore additional information for e.g. identification of the stack height or to recognize foreign material, which is often abdicated in normal image processing, is available with the EyeVision 3D software.
12th May 2017


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EPE 2017 ECCE Europe
11th September 2017
Poland Warsaw
DSEI 2017
12th September 2017
United Kingdom ExCeL, London
RWM 2017
12th September 2017
United Kingdom NEC, Birmingham
Productronica India 2017
14th September 2017
India Pragati Maidan, New Delhi
Industry of Things World 2017
18th September 2017
Germany Berlin Congress Center