Inspection & Test

Displaying 281 - 290 of 327

Easy-to-use SPI system boasts 6.4TFLOPS

Easy-to-use SPI system boasts 6.4TFLOPS
Vi Technology's Pi (π) SPI system has been purchased by Hunter Technology and installed in its Silicon Valley facility. In a competitive side-by-side evaluation, the Pi was the clear choice for Hunter Technology. This next-gen SPI features ease of programming, ease of maintenance, operator friendliness and automatic threshold settings.
29th December 2014

Thin die tester meets SEMI standard

Thin die tester meets SEMI standard
Nordson DAGE has introduced a new test method for the evaluation of die strength by means of cantilever bending where 3 point bending is not suitable for die with a thickness of less than 50 microns. Die with thickness below 50 microns tend to be very compliant, in fact so much so that it becomes virtually impossible to apply a test load.
11th December 2014

PCB size no problem for automated inspection system

PCB size no problem for automated inspection system
GOEPEL electronics is offering a variant of the inline AOI system AdvancedLine for the inspection of overlength PCBs. The longboard AOI system enables testing of assembled and soldered PCBs with a length of up 1,600mm. An adjustment for even longer PCBs is also possible due to the flexibility of the overall design.
1st December 2014


Process line ID modules provide marking & separation

Process line ID modules provide marking & separation
Designed for automated test lines, the JOT Scanner Unit SCU-439 and JOT Fail Separation Unit FMM-440 modules have been released by JOT Automation. The devices can be used alongside any process equipment that needs product identification data, or where there is a need to mark or separate faulty products post-processing.
26th November 2014

SPI results connect to OS in real-time

PARMI and Aegis Software have announced the development of the xLink adapter to enable real-time connectivity of SPI results to Aegis’ FactoryLogix Manufacturing OSs. With real-time data integration, manufacturers immediately can identify SPI defects and take corrective actions to improve PCB yield.
20th November 2014

Test chips allow pre-production thermal engineering

Test chips allow pre-production thermal engineering
Thermal Test Chips (TTCs) designed by JVD can be used to save time and money in the design and thermal management of ASICs and ASSPs, by allowing thermal engineering of components prior to investment in the expensive silicon required for production. With smaller, more powerful, faster devices thermal management is an ever-increasing concern for designers.
19th November 2014

Sophisticated X-ray ensures hassle-free PCBA inspection

Sophisticated X-ray ensures hassle-free PCBA inspection
Subcontract manufacturers of PCBAs generally use a number of different tools for quality control, such as flying probe testers, camera-based automated optical inspection and X-ray equipment. Very few UK manufacturers can boast such sophisticated X-ray inspection capability as Newbury Electronics, following the company’s purchase of a Nikon Metrology XT V160 in January 2014.
18th November 2014

Benefits of AOI to be discussed at Technology Event

ViTrox Technologies will participate in Etek’s Technology Event, scheduled to take place from 5th to 6th November 2014 in Prestwick, Scotland. Tan Piet Gek, Senior Engineer & Technical Support (PCA-AOI), will present 'AOI PCBA Inspection'.
6th November 2014

Extended x-ray inspection range caters for larger assemblies

Extended x-ray inspection range caters for larger assemblies
Viscom has extended its portfolio in the x-ray inspection range with a flexible inspection system. The X8068 universal x-ray inspection system unites the high inspection quality and technology of the Viscom x-ray systems with an extended inspection scope for larger electronic assemblies. With this solution, electronics manufacturers could not be better equipped as far as both test piece size and application are concerned.
6th November 2014

X-Ray metrology tool claimed to be faster & more precise

X-Ray metrology tool claimed to be faster & more precise
  Nordson DAGE has announced its most recent order from a major customer in the semiconductor industry for its XM8000 wafer X-ray metrology tool. It will be used for the automatic measurement of wafer bumps and Through Silicon Vias (TSVs) using 2D and 3D x-ray inspection methods.
5th November 2014


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