Inspection & Test

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SPI's angle cameras measure solder paste deposit

SPI's angle cameras measure solder paste deposit
Vi Technology's Pi SPI system offers the customer an immersive print process experience, with unparallelled vision and measurement capabilities. According to Vi, the Pi system is the first SPI to use angle cameras, in conjunction with 360° Moiré technology, to measure the solder paste deposit.
28th October 2014

CyberOptics brings SPI & AOI to Matelec

CyberOptics brings SPI & AOI to Matelec
CyberOptics will exhibit with its representative, Accelonix Iberica, in Booth 4D04 at Matelec 2014, scheduled to take place 28th-31st October at Ifema - Parque Ferial Juan Carlos I in Madrid, Spain. CyberOptics’ flagship 3D SPI system, the SE600, and high-performance QX600 AOI system will be demonstrated at the show.
22nd October 2014

Test company takes JTAG tools to Seattle

Test company takes JTAG tools to Seattle
Eindhoven-based JTAG Technologies will travel to the International Test Convention in Seattle (Oct 21-23) to showcase a range of products and some new system upgrades. Newly available as an addition to its standard range of tools, is a module aimed at the support of new IEEE P1687 (aka IJTAG – Internal JTAG) compliant devices. 
16th October 2014


Modular design enhances test bench

Modular design enhances test bench
Lian-Li Industrial has unveiled the brushed aluminum PC-T80 DIY Test bench. An update of the PC-T60, the PC-T80 has added native radiator support and a more modular design. With dimensions of 440mm x 435mm x 335mm (17.3in x 17.1in x 13.1in) WxHxD, the test bench is separated into three zones, allowing for easy configuration and updates of hardware.
16th October 2014

electronica 2014: Thermal imaging solution makes debut

electronica 2014: Thermal imaging solution makes debut
Canada-based Acculogic travel to electronica armed with an array of test equipment. Pride of place goes to the the FLS980 Series III with the Ultimate Accuracy Package Option along with high-throughput features such as the latest version Flying Bed of Nails (FBON). The new ThermoScan thermal imaging test solution and MircoScan miniature image observation and testing solutions will be unveiled at the show for the first time.
15th October 2014

Conformal coating inspection system extends scope

Conformal coating inspection system extends scope
Viscom will be demonstrating the S3088 Conformal Coating Inspection (CCI) system at electronica in Munich (Nov 11-14). The system which inspects protective conformal coating quickly, with full reliability is now being offered with an extended inspection scope. The system can now be equipped with angled cameras for reliable inspection between components. A wet inspection that checks the conformal coating for flaws before complete curing also is available.
14th October 2014

TTC solution meets assembly line traceability needs

TTC solution meets assembly line traceability needs
Cogiscan has joined forces with Juki to provide VIP-VIRANT Group with a complete TTC solution for its new assembly line.  VIP-VIRANT Group’s new fully integrated assembly line consists of JUKI loaders, transport systems and linked repairing stations. The JUKI GL printer together with the JUKI SPI/AOI system RV-1, a nitrogen reflow oven and two JUKI mounters also are included.
13th October 2014

Combo-system for wire bond inspection exceeds expectations

Combo-system for wire bond inspection exceeds expectations
Power module manufacturer Danfoss Silicon Power has supplemented its existing Viscom X8051 with additional X7056BO combo-systems for wire bond inspection. Using the recognition of bond feet to analyse how the wire must lie, the X7056BO inspects the path of the wire in wire bond connections with AOI. Boasting reduced acquisition costs, low false alarm rates and a high productivity, Danfloss currently has four X7056BO systems.
12th September 2014

Achieve fast & reliable automated x-ray inspection

Achieve fast & reliable automated x-ray inspection
Suitable for in-line or off-line operation, Nordson DAGE has introduced an automated x-ray inspection system. The Xi3400 offers complete inspection of solder joints and other critical hidden features found in electronic assemblies, PCBs and packaged semiconductors. The system's algorithms enable fast and reliable automated inspection and real-time monitoring of critical process information.
4th September 2014

Nordson DAGE to discuss X-ray inspection at SMTAI

At the upcoming SMTA International exhibition, Dr. Evstatin Krastev, Director of Applications, Nordson DAGE, will present two papers. Dr. Krastev co-authored both papers, titled: 'X-ray / Bondtester Reliability Study of BGA Devices – Impact of Interfacial Voiding' and 'Optimizing X-ray Inspection with Package on Package'.
2nd September 2014


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