Manufacturing & Process Software

Displaying 91 - 100 of 104

Tools achieve certification for TSMC’s 16nm FinFET process

Digital tools from Cadence Design Systems have received V1.0 DRM and SPICE certification for TSMC’s 16nm FinFET process, enabling joint customers to begin taping out FinFET-based designs using Cadence tools. Cadence’s digital, custom/analog and signoff tools have been co-optimized with TSMC’s 16nm FinFET process to enable higher performance, lower power consumption and smaller area for advanced designs.
15th April 2014

Software achieves certification for 16nm FinFET process

Mentor Graphics has announced that its IC design to silicon solution has achieved certification for TSMC’s Design Rule Manual (DRM) and SPICE model version 1.0 for its 16nm FinFET process. The certification includes tools in the Calibre physical verification and DFM platform, as well as the Olympus-SoC place and route system, the Pyxis custom IC design platform, and Eldo SPICE simulator.
15th April 2014

Traceability software harvests & reports data from Speedline printers

Due to be unveiled at APEX 2014 in booth #2215, a new traceability software marks the first product resulting from the recent colloboration between Speedline Technologies and Cogiscan. The software, based on Cogiscan TTC technology, can harvest and report traceability data from Speedline printers. 
26th March 2014


Software feature reduces electrical power consumption

A feature in the latest release of the company's windows-based WINCON operating system, the ENERGY PILOT software feature is designed to reduce the consumption of electrical power and process gas for manufacturers that may have interruptions in production.
21st March 2014

Simplifying and Accelerating challenging designs

Mentor Graphics announce the first phase of a new systems design enterprise platform to address today's PCB systems challenges of increased complexity, changing team demographics and systems-aware design requirements. The Xpedition platform significantly simplifies and accelerates the development of the industry’s most challenging designs.
19th March 2014

System certified for 65nm to 14nm FinFET processes

Cadence Design Systems has announced that GLOBALFOUNDRIES certified the Cadence PVS for custom/analog, digital and mixed-signal design physical signoff for 65nm to 14nm FinFET process technologies. The certification covers Cadence-qualified PVS rule decks for physical verification used in Cadence Virtuoso® Integrated Physical Verification System, Cadence Encounter Digital Implementation System and full-chip signoff.
11th March 2014

Benchtop reflow oven is controlled by Android OS

Benchtop reflow oven is controlled by Android OS
By simulating the environment of an inline reflow system in a small footprint, Manncorp’s MC-301 Benchtop Reflow Oven is suitable for prototyping, manufacturability testing and short-run batch production. It features an innovative Android-based operating system and high-resolution touchscreen user interface.
7th March 2014

Environment speeds PCB timing closure by up to 67%

Speeding timing closure by up to 67%, Cadence Design Systems has announced that the Allegro TimingVision environment is now available within Cadence Allegro PCB Designer. This environment makes it possible for PCB designers to save significant time in ensuring that signals in an interface meet timing requirements.
6th March 2014

Adapters attach test leads to hex screws quickly & safely

Adapters attach test leads to hex screws quickly & safely
A range of adapters now enable test leads to be quickly and safely attached to hex socket screws. The Variogrip adapters from Multi-Contact have a split hexagonal tip that expands on turning a knob at the rear so that it is firmly held inside the socket.
20th February 2014

Ultra-fast setup software for JT Reflow ovens

Juki Automation Systems announces that its JT ovens will be shipping standard with KIC’s Auto-Focus software. The new capability will be launched at the upcoming IPC APEX EXPO, scheduled to take place February 19-21, 2013 at the San Diego Convention Center in California
15th February 2013


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