Materials

Displaying 731 - 740 of 773

Conformable TIM offers thermal conductivity of 11 W/m°K

Conformable TIM offers thermal conductivity of 11 W/m°K
The introduction of a 1.0 mm thick sheet signals an expansion of Fujipoly’s Sarcon XR-Pe product offering. Conforming to most CPU and semiconductor shapes, the material offers thermal conductivity of 11 W/m°K (ASTM D 5470) with a thermal resistance as low as .06°Cin2/W.
29th July 2014

Supercapacitor materials market to reach $5bn by 2025

Based on the report 'Functional Materials for Supercapacitors / Ultracapacitors / EDLC 2015-2025', IDTechEx has forecast that the market for functional materials for supercapacitors will reach $5bn by 2025.
25th July 2014

Low bio-persistent solution performs at up to 1300°C

Low bio-persistent solution performs at up to 1300°C
A low bio-persistent solution ideal for use in ceramics, glass and metals manufacturing processes, as well as in commercial automotive and consumer goods applications, has been introduced by Morgan Advanced Materials. Offering a low bio-persistent-solution, the Superwool fibre papers are non-wetting to molten aluminium and feature low thermal conductivity, excellent tensile strength, thermal stability, and resistance to chemical attack. 
17th July 2014


Nanoparticle ink suits room-temperature printing

Nanoparticle ink suits room-temperature printing
A nanoparticle ink which can be used in room-temperature printing has been developed by MANA. Previously, nanoparticle inks could only be used in high-temperature printing because they were surrounded by non-conductive ligands and required annealing. Researchers have created a nanoparticle ink surrounded by planar aromatic molecules which, therefore, does not require annealing.
10th July 2014

Filler achieves a 20% increase in polymer thermal performance

A filler claimed to increase polymer thermal performance while reducing production costs, has been introduced by Carbodeon. By using 0.03wt.% nanodiamond material at 45% thermal filler loading the company can achieve a 20% increase in polymer thermal performance. Last October, Carbodeon published its data on thermal fillers showing that the conductivity of polyamide 66 (PA66) based thermal compound could be increased by 25% by replacing 0.1wt.% of the level of boron nitride filler (45wt.%) with nanodiamond material. The latest refinements in nanodiamond materials and compound manufacturing allow for 70% less nanodiamond consumption and thus, a reduced cost.
10th July 2014

Robots target material handling and machine tending

Robots target material handling and machine tending
  Expanding the company's portfolio of small robots, ABB has introduced the IRB 1200. This compact robot is designed for materials handling and machine tending applications which require flexibility, ease of use, compactness and short cycle times while maintaining large working envelopes.
8th July 2014

CVD materials enable 300+ mm diameter component manufacture

CVD materials enable 300+ mm diameter component manufacture
A range of materials grown using CVD (chemical vapour deposition) processes has been introduced by Morgan Advanced Materials. Morgan's CVD SiC (Silicon Carbide) and PBN (Pyrolytic Boron Nitride) are suitable for use in semiconductor applications such as rapid thermal processing and plasma etch process chamber components.The materials are also suited for use in metalorganic CVD tools for high-brightness white LED manufacturing, using the indium gallium nitride process.
8th July 2014

Could graphene FETs drive greater RF integration?

Could graphene FETs drive greater RF integration?
There is growing anticipation that graphene will soon emerge as a replacement for silicon, fuelled by its outstanding promise. Now, a lack of progress towards monolithic integration may have turned an important corner thanks to the latest R&D breakthroughs, as Philip Ling reports.
8th July 2014

TIMs target high-performance electronics

TIMs target high-performance electronics
Techsil have introduced 2 new one-component thermal interface materials to the electronics market. While fans, heat sinks, and even liquid cooling and thermoelectric devices can be used to provide enough cooling power, the problem remains to get the heat from the hot components into the cooling hardware. Thermal Interface Materials (TIMs) are designed to fill in air gaps and microscopic irregularities, resulting in dramatically lower thermal resistance and thus better heat dissipation and cooling.
1st July 2014

Laminates & prepegs reduce insertion loss

Isola Group has announced the introduction of Tachyon-100G laminates and prepregs, which enable line cards required to transmit 100GbE at data rates in excess of 25Gb/s per channel. Tachyon-100G has identical electrical properties as its predecessor Tachyon; however, the Z-axis CTE on Tachyon-100G is more than 30% lower than Tachyon, making it more suitable for fabricating high-layer count, 0.8 mm pitch line cards with heavy 2 oz. copper inner layers.
1st July 2014


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Motek 2017
9th October 2017
Germany Stuttgart