Materials

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CVD materials enable 300+ mm diameter component manufacture

CVD materials enable 300+ mm diameter component manufacture
A range of materials grown using CVD (chemical vapour deposition) processes has been introduced by Morgan Advanced Materials. Morgan's CVD SiC (Silicon Carbide) and PBN (Pyrolytic Boron Nitride) are suitable for use in semiconductor applications such as rapid thermal processing and plasma etch process chamber components.The materials are also suited for use in metalorganic CVD tools for high-brightness white LED manufacturing, using the indium gallium nitride process.
8th July 2014

Could graphene FETs drive greater RF integration?

Could graphene FETs drive greater RF integration?
There is growing anticipation that graphene will soon emerge as a replacement for silicon, fuelled by its outstanding promise. Now, a lack of progress towards monolithic integration may have turned an important corner thanks to the latest R&D breakthroughs, as Philip Ling reports.
8th July 2014

TIMs target high-performance electronics

TIMs target high-performance electronics
Techsil have introduced 2 new one-component thermal interface materials to the electronics market. While fans, heat sinks, and even liquid cooling and thermoelectric devices can be used to provide enough cooling power, the problem remains to get the heat from the hot components into the cooling hardware. Thermal Interface Materials (TIMs) are designed to fill in air gaps and microscopic irregularities, resulting in dramatically lower thermal resistance and thus better heat dissipation and cooling.
1st July 2014


Laminates & prepegs reduce insertion loss

Isola Group has announced the introduction of Tachyon-100G laminates and prepregs, which enable line cards required to transmit 100GbE at data rates in excess of 25Gb/s per channel. Tachyon-100G has identical electrical properties as its predecessor Tachyon; however, the Z-axis CTE on Tachyon-100G is more than 30% lower than Tachyon, making it more suitable for fabricating high-layer count, 0.8 mm pitch line cards with heavy 2 oz. copper inner layers.
1st July 2014

Low viscosity two component epoxy is optically clear

Low viscosity two component epoxy is optically clear
Master Bond EP112LS is a two part epoxy that is well suited for impregnation, potting, encapsulation, sealing and coating applications, particularly in the aerospace and optoelectronics industries. EP112LS is optically clear, features reliable non-yellowing properties and has a refractive index of 1.55.
27th June 2014

Imec joins Graphene Flagship

To coincide with Graphene Week 2014, the Graphene Flagship announce that one of the largest-ever European research initiatives is doubling in size. 66 new partners are being invited to join the consortium following the results of a €9 million competitive call. While most partners are universities and research institutes, the share of companies, mainly SMEs, involved is increasing.
27th June 2014

The What, Why And How Of Rubber Specifictions For Sealing Profiles – A Whitepaper By Andy Billingham, M.D., EMKA UK

Choosing a sealing profile does not have to involve choosing the material as there are many standard sections in standard rubbers found to be suitable for general purposes such as control cabinet door sealing, where specification may be made primarily on the correct mechanical fit.
19th June 2014

New graphene-type material created

New graphene-type material created
Scientists at the University of Liverpool have created a new material, related to graphene, which has the potential to improve transistors used in electronic devices. The material, ‘triazine-based graphitic carbon nitride’, or TGCN, was predicted theoretically in 1996, but this is the first time that it has been made.
22nd May 2014

Thermal material for automotive and industrial applications

Thermal material for automotive and industrial applications
Featuring a tough polyimide carrier to fulfil demanding automotive and industrial applications, the high-durability Gap Pad 1000HD thermal material has been introduced by Bergquist. The polyimide carrier maximises puncture and tear resistance and enhances handling characteristics, while also ensuring high dielectric breakdown voltage of over 10,000V.
24th April 2014

Thermal material minimises fogging of lenses or optics

Thermal material minimises fogging of lenses or optics
The first in a line of low-volatility dispensable thermal interface materials, Bergquist has introduced Gap Filler 1500LV. The two-component liquid dispensable thermal interface material is optimised for applications such as LED lighting where designers need to minimise fogging of lenses or optics.
24th April 2014


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