Epoxy features enhanced dimensional stability

9th October 2017
Posted By : Peter Smith
Epoxy features enhanced dimensional stability

Developed by Master Bond for potting, sealing, encapsulation and casting applications, EP110F8-5 is dimensionally stable and has low shrinkage upon cure. This system is said to feature superior electrical insulation properties including a volume resistivity exceeding 1015 ohm-cm, a dielectric constant of 2.91 at 1 KHz and a dissipation factor of 0.009 at 1KHz.

This two-component epoxy has a  forgiving one to two mix ratio by weight with a moderate mixed viscosity of 7,000-11,000 cps and good flow properties. It requires an elevated temperature cure at 250-300°F in 4-6 hours. EP110F8-5 has a very long pot life of 2-3 days at room temperature.

EP110F8-5 is a rigid system with a Shore D hardness of 70-80, but also maintains excellent toughness and offers an elongation of 40-60%. Its toughness imparts an ability to withstand thermal cycling as well as impact and vibration. In fact, it passes 10 thermal shock cycles of -55°C to +125°C. With a compressive strength of 18,000-20,000 psi, EP110F8-5 adheres well to a wide variety of substrates, including metals, composites, glass and many plastics. It resists exposure to water, oils and fuels.

It is serviceable over the wide temperature range of -100°F to +300°F [-73°C to +149°C]. Part A of EP110F8-5 is tan in color and Part B is brown. This system is available for use in ½ pint, pint, quart, gallon and 5 gallon container kits.


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