Fast curing adhesive bonds SMDs on to circuit boards

9th November 2017
Posted By : Alice Matthews
Fast curing adhesive bonds SMDs on to circuit boards

Global supplier of industrial RTV silicones, adhesives, sealants, encapsulants, conformal coatings, tapes, casting and mould making materials, Techsil, has launched a new fast curing epoxy adhesive Structalit 5610 from manufacturers Panacol. This adhesive is specially designed for bonding Surface Mounted Devices (SMDs) on to circuit boards. Due to its high viscosity the adhesive is well-suited for screen printing.

Structalit 5610 is a red-coloured epoxy adhesive which makes a suitable contrast to green circuit boards. The one-component adhesive is easily applied via dispenser, screen printing or needle transfer.

The SMD adhesive cures thermally within minutes, even at low temperatures. At the same time it is highly temperature-resistant: Temporarily it can be exposed to temperatures up to 280°C, making it a suitable adhesive for reflow soldering.

Once cured, Structalit 5610 is shock-resistant and features high adhesion to FR4 circuit boards, to metals and to epoxy-based mould materials.

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