Component Management

FIP shielding materials at productronica

23rd October 2017
Peter Smith
0

Electrolube will launch two FIP EMI shielding materials and a new cleaning solution at this year’s productronica - (Booth A4.466). Electrolube’s new Form-In-Place (FIP) EMI Shielding Materials include the FIP100 and FIP200. The FIP100 single component thermal cured shielding material has been developed for ease of dispensing and provides high shielding effectiveness.

With what is said to be a good compression set and high tensile strength, FIP100 is a Nickle/Graphite filled silicone material, providing stable, long term shielding effectiveness in harsh environments. The UL V-0 rated material is typically used in shielding cover applications which include RRU, AAS and Filters.

The single component moisture cured system, FIP200, is a Silver/Nickle/Copper filled silicone Form-In-Place EMI shielding material. The environmentally friendly and low odour material provides 45 shore A hardness and an extra low deflection force. The material retains superior shielding performance in harsh environments and provides long-term reliability. Ideal for applications including smart phones, high speed connectors and automotive applications, FIP200 provides corrosion resistance on Cr (III), Cr (VI) and bare Al flanges. The UL V-0 rated material is fast cure with a touch dry time of 2 minutes at 25°C and enables high dispensing performance. 

Cleaning essentially helps to improve product lifetime by ensuring good surface resistance and by preventing current leakage leading to PCB failure. Electrolube’s newest cleaning solution, SWCC, Safewash Components Cleaner, is a new cleaning medium specifically designed for the semiconductor industry to remove all types of flux residues onPCBA and electronic assemblies.

Demonstrating excellent material compatibility, SWCCcontains corrosion inhibitors to enable safe cleaning of sensitive metals such as solder joints, copper, aluminium and zinc.SWCC’s low surface tension also makes it ideal for flip-chip applications. The new cleaning solution is free of any halogenated compounds, making it 100% ozone friendly, yet providing a high level of solvency for removing flux residues.

The RoHS compliant cleaner is ideal for use in ultrasonic, spray-under-immersion and centrifugal cleaning systems. Application temperatures vary from35-60°C and cleaning times will depend on the nature of residues as well as the process temperature. Typically, cleaning times take between 5-20 minutes, followed by thorough rinsing in DI water and hot air drying. SWCC is surfactant-free, making it far easier for rinsing and is ready to use at pure concentration.

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