Techcon at Vienna’s FEICA Conference
Techcon Systems will exhibit at the FEICA 2016 Conference and EXPO, taking place September 7-9, 2016 in Vienna and will discuss its new custom filling service for European customers where the company can fill one part or multi-component liquid materials into just about any container, bag, tube, cartridge, syringe, or bottle.
As part of the service, Techcon provides accurate mixing equipment and dry plastic containers as well as repackaging services, which are customized and designed to meet the requirements of the individual dispensing application. The entire know-how of the dispensing experts will be integrated and accomplished by user-friendly, dispensable one- and multi-component packaging systems.
Product Spotlight
APV1111GVY
Panasonic
Panasonic PhotoMOS® Photovoltaic MOSFET High-Power Drivers
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| Stock: | 3490 |
| Cost: | $3.95 |
