Soldering

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Laser soldering alleviates miniaturisation issues

Laser soldering alleviates miniaturisation issues
Packing densities increase on ever smaller electronic assemblies due to technical requirements and possibilities. Accordingly, the requirements imposed on soldering these components become all the more stringent because, for instance, sensitive components have to be protected from great heat effects. Pinpoint-accurate, fast, and definable soldering is necessary. Therefore, EUTECT has been using diode lasers for its customised soldering systems.
22nd November 2017

No-clean solder pastes with low melting point

No-clean solder pastes with low melting point
Heraeus Electronics showed its range of no-clean soldering pastes with a low melting point at productronica this week. The new F498 product series is said to allow significant cost savings in the soldering process. The soldering pastes are characterized by a low void rate and outstanding wetting properties on a wide range of different surfaces. This reduces the formation of solder balls (mid-chip balling). 
16th November 2017

Pastes have low melting point for energy efficient soldering processes

Pastes have low melting point for energy efficient soldering processes
Heraeus Electronics has expanded its range of no-clean soldering pastes with a low melting point. The new F498 product series allows significant cost savings in the soldering process. The new series of soldering pastes is characterised by a low void rate and outstanding wetting properties on a wide range of different surfaces. This reduces the formation of solder balls (mid-chip balling).
15th November 2017


Soldering station provides process traceability

Soldering station provides process traceability
Now available from Farnell element14, the Metcal CV-5200 Soldering Station incorporates Metcal’s patented Connection Validation technology to provide real-time closed-loop feedback on intermetallic compound formation: a key indicator of soldered joint quality. The CV-5200 also incorporates a new communication port that enables the addition of process traceability software and firmware upgrades, making investment in the unit future-proof.
14th November 2017

Hybrid flux for wave and selective soldering

Hybrid flux for wave and selective soldering
Emil Otto GmbH  has introduced an alcohol-water-based flux which is also obtainable as a granulate-based concentrate.The hybrid EO-Y-004 flux was developed for use in wave and selective soldering and exhibits a solids content of 3.5% to 3.7%. That it has been developed for use in wave and selective soldering makes it suitable for a broad range of applications.
19th October 2017

The 411 on soldering electrical components

The 411 on soldering electrical components
Soldering is an important part of working with electronic components. In order for the necessary components to be firmly connected and for a current to flow smoothly, there is some essential equipment needed and some important techniques to master.  Author: Holger Engelbrecht (pictured), Product Manager, reichelt elektronik
3rd October 2017

Efficient enamelled-copper wire soldering

Efficient enamelled-copper wire soldering
According to EUTECT, it has been developing and manufacturing selective soldering modules for processing copper wire for many years. Now, tightening thermal requirements imposed between copper wire and connectors in sectors like the automotive supply and consumer goods industries, cause the requirements imposed on the soldering process to tighten as well. As a result, EUTECT says it is continually investing in improving its selective soldering module.
12th September 2017

Selective solder system adds flexibility

Selective solder system adds flexibility
Kurtz Ersa North America just announced that Electronic Systems has purchased and installed a VERSAFLOW 3/45 selective soldering system. Electronic Systems is headquartered in Sioux Falls, SD, and operates three facilities there. VERSAFLOW 3/45 is reckoned to be the industry’s most widely used in-line selective soldering platform and most repeatable system on the market. It is said to be the first in-line selective soldering machine with dual track transport, and features the highest flexibility and throughput that can be realized with the smallest possible required space.
21st August 2017

Solder paste for fine feature printing

Indium Corp has just released Indium11.8HF-SPR (T5-MC) Solder Paste. According to the company it is a new air and nitrogen reflow, no-clean, Pb-free solder paste designed to meet the fine feature printing requirements of mobile manufacturers.
7th August 2017

Seminar will focus on solder joint reliability

Indium Corporation is to partner with 3S Silicon Tech, Inc. to host a technology seminar on solder joint reliability for automotive electronics on Aug. 11 in Taiwan Hsinchu.
28th July 2017


Soldering documents


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