Soldering

Displaying 181 - 188 of 188

Jet solder paste and mount components in one machine

Jet solder paste and mount components in one machine
At the IPC APEX Expo, March 25-27, 2014, Mandalay Bay Resort & Convention Center in Las Vegas, Essemtec will debut its new SMT production centre in booth #851. The company has claimed that this is the first combined SMT production centre which is able to jet solder paste and mount components in one machine.
29th January 2014

Soldering machine eliminates loss of production

Soldering machine eliminates loss of production
Kurtz Ersa has reported that LSI ADL Technology has purchased an Ersa VERSAFLOW 3/45 in-line selective soldering machine. The machine has the ability to have both lead and lead-free solder alloys in each soldering module, which eliminates loss of production experienced with older machines.
28th January 2014

Stencil confronts electronic assembly demands

Stencil confronts electronic assembly demands
Claiming to be the world’s most advanced stencil technology for solder paste printing, FCT Assembly have launched the NanoSlic Gold stencil. The stencil recieved the 2013 NPI Award for coatings/encapsulates.
22nd January 2014


A New Technology for Void-Free Reflow Soldering

A New Technology for Void-Free Reflow Soldering
SEHO Systems now offers a new technology for virtually void-free soldering results with the MaxiReflow HP. Whether for power electronics, electronic aviation systems, medical equipment or electronic systems for the automotive industry, voids in solder joints represent one of the main problems.
13th February 2013

Rehm Thermal Systems Announces Three Next-generation Soldering Solutions

Rehm Thermal Systems announces its next-generation advanced packaging and semiconductor solutions with no atmosphere – the Vacuum Soldering process. Rehm offers three VS Series Vacuum Soldering system models. They’re all small, all powerful, and all low cost. The VS320, the VS160UG, and the VS160S benchtop each feature fast heating and cooling rates with easy profile setup and editing plus data logging.
25th January 2013

Gemini Integrated Electronics announce the launch of its own solder fume extraction device to complement its range of bench top ESD equipment.

As a result of customer requests and ongoing in-house developments, Gemini Integrated Electronics has introduced a new solder fume extraction device to complement its range of bench-top ESD equipment. The extraction unit is ideally suited to areas where space is at a premium.
27th March 2012

Manncorp debuts 2-pot dual-wave solder machine for easy lead-free/Pb switchover

PCB assemblers -- particularly contractors -- faced with the need to go lead-free while maintaining a tin/lead soldering presence, will welcome Manncorp's 16.350 wave solder machine. In place of the usual single pot, the 16.350 can now be configured with two pots on roll-out carts to provide lead-free-to-Pb switching with ease.
4th November 2011

Manncorp’s Split-vision Rework Station Has Auto Removal/Placement Head, For Bgas And Qfps

Manncorp’s Split-vision Rework Station Has Auto Removal/Placement Head, For Bgas And Qfps
BGAs, QFPs and other fine-pitch devices can now be desoldered, removed and replaced with the BR720 lead-free rework station from Manncorp. Utilizing split-vision zoom optics with 22x magnification, real-time images of components superimposed on solder pads are continuously displayed on the system monitor. Perfect alignment is achieved when operator makes final X and Y micrometer adjustments with LED lighting providing high image contrast.
18th February 2011


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