Solder paste for fine feature printing

7th August 2017
Posted By : Peter Smith

Indium Corp has just released Indium11.8HF-SPR (T5-MC) Solder Paste. According to the company it is a new air and nitrogen reflow, no-clean, Pb-free solder paste designed to meet the fine feature printing requirements of mobile manufacturers.

Indium11.8HF-SPR is said to specifically address the move toward type 5 powder. This new solder paste delivers what Indium describes as unprecedented stencil print transfer efficiency on the broadest range of processes, while maintaining industry-leading reflow performance. Key features include: Halogen-free per IEC 61249-2-21 test method EN14582; High-transfer efficiency through small apertures (≤ 0.66AR): Long stencil life (>12 hours); the elimination of a hot and cold slump to inhibit bridging and solder beading defects and it is said to avoid the potential for HIP and graping defects with a unique oxidation barrier.


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