Adhesives

Displaying 1 - 10 of 194

One component epoxy features thermal cycling resistance

One component epoxy features thermal cycling resistance
  The Master Bond Supreme 17HT is a single component, no mix epoxy system for bonding and sealing applications featuring an unlimited working life at room temperature.
20th May 2019

Light fixation for two-component epoxy resins

Light fixation for two-component epoxy resins
A light fixation for two-component epoxy resins has been introduced by DELO. Thanks to this hybrid chemistry, users benefit from faster, less complex production processes and simplified logistics. DELO-DUOPOX DB8989 provides high speed for a two-component epoxy resin, securing the components against slipping in just a couple of seconds.
16th May 2019

Efficient RAIN RFID label manufacturing

Efficient RAIN RFID label manufacturing
A new development in the effort to achieve high-volume inlay manufacturing has been announced by DELO Industrial Adhesives, Mühlbauer and Impinj. The three RAIN RFID companies have successfully teamed to deliver DELO MONOPOX AC6545, supporting the high-speed assembly of copper-bonded RFID chips such as the Impinj Monza 6 family on Mühlbauer high speed assembly lines.
14th May 2019


Primerless silicone encapsulant now available

Primerless silicone encapsulant now available
It has been announced that Ellsworth Adhesives are now taking orders for the newly-launched Dowsil (Dow) EI-2888 Primerless Silicone Encapsulant. Dowsil EI-2888 is an optically clear encapsulant designed for professional LED lighting applications. The 100% silicone encapsulant provides LEDs with essential protection from moisture and surface contaminants. 
14th May 2019

EMI shielding solutions with electrically-conductive adhesive

EMI shielding solutions with electrically-conductive adhesive
At the Battery Show Europe 2019 (Hall 1, Stand 349), Dow introduced the new DOWSIL EC-6601 Electrically Conductive Adhesive, a next-generation material engineered for reliable performance and electromagnetic compatibility (EMC) in demanding electrical and electronics applications in the transportation, communications and consumer markets.
9th May 2019

Dual curing epoxy meets biocompatibility requirements

Dual curing epoxy meets biocompatibility requirements
A single component, nanosilica filled compound featuring a UV and heat curing mechanism has been released by Master Bond, with the UV22DC80-1Med. Not only does it pass USP Class VI Tests for biocompatibility, but it also meets ISO 10993-5 for cytotoxicity, making it ideal for many applications in the medical device industry. 
24th April 2019

Adhesives dispensing expertise shared at FAST Live

Adhesives dispensing expertise shared at FAST Live
To help the industry better tackle the challenges of technology and manufacturing using adhesives and protective materials, Peter Swanson, Managing Director at adhesives specialist Intertronics, ran a seminar at FAST Live. Swanson offered insights into dispensing technology, process validation and the latest positive displacement and jetting technologies.
15th April 2019

Electrically conductive adhesives at Intersolar Europe

Electrically conductive adhesives at Intersolar Europe
Global supplier of conductive interconnect materials, Engineered Material Systems, will exhibit in Hall C1, booth 354 at the Intersolar Europa Solar Power Expo, scheduled to take place May 15th to 17th, 2019 in Munich, Germany. Company representatives will show next-generation low-cost electrically conductive adhesives for stringing, shingling and back contact applications in crystalline silicon and heterojunction solar modules.
12th April 2019

Structural adhesive supports Wisconsin Racing

Structural adhesive supports Wisconsin Racing
Manufacturer of industrial adhesives for automotive, consumer and industrial electronics applications, is a sponsor of Wisconsin Racing at the University of Wisconsin. DELO has supplied Wisconsin Racing’s Formula Electric team with DELO MONOPOX HT2860 to bond together the magnet segments in the car’s electric motor. The adhesive is also used for final rotor assembly.
11th April 2019

Graphene filled epoxy offers thermal conductivity

Graphene filled epoxy offers thermal conductivity
The newly introduced EP30NG from Master Bond is a two part epoxy adhesive system developed for applications that require high thermal conductivity. It contains a specialty graphene filler which contributes not only to its high compressive strength, but also to its enhanced dimensional stability. 
5th April 2019


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Sensor+Test 2019
25th June 2019
Germany Nürnberg Messe
DSEI 2019
10th September 2019
United Kingdom EXCEL, London
European Microwave Week 2019
29th September 2019
France Porte De Versailles Paris
Engineering Design Show 2019
16th October 2019
United Kingdom Ricoh Arena, Coventry
ELIV 2019
16th October 2019
Germany Bonn World Conference Center