Adhesives

Displaying 1 - 10 of 166

Two component epoxy with thermal shock resistance

Two component epoxy with thermal shock resistance
Master Bond EP110F8-3 is a two part epoxy system ideal for sealing, encapsulating, potting, and casting applications. “This toughened system provides very good flexibility and possesses a relatively high elongation of 120-150%”, said Rohit Ramnath, Senior Product Engineer. “It offers a low tensile modulus of around 5,000-15,000 psi and a shore A hardness of 40-50 at room temperature."
10th September 2018

Label confirms successful sterilisation

Label confirms successful sterilisation
  Brady Corporation's new Sterilisation indicating labels provide users with proof of sterilisation. They are well suited to a broad range of laboratory processes including sample tracking, inventory management, general tracking, and glassware or tray identification.
7th September 2018

Tin free silicone avoids conflicting chemistries and assembly time

Tin free silicone avoids conflicting chemistries and assembly time
WACKER ELASTOSIL N9111 from Intertronics is a tin-free single part RTV silicone adhesive sealant, with a neutral cure chemistry, producing a non-corrosive seal that does not inhibit other materials such as platinum cure silicones. This, along with its UL94 V-0 rating, makes it a strong candidate for electronics manufacturing, especially for gap filling, component ruggedisation, and form-in-place gasketing. It is stocked in depth at Intertronics for next-day delivery.
17th August 2018


Bringing portability, precision and power to UV curing

Bringing portability, precision and power to UV curing
To improve UV curing options available for the medical, industrial, electronics, automotive and optical industries, adhesives specialist Intertronics has launched the IUV101 LED UV curing spot lamp. The new 370nm handheld spot lamp offers up to 2,000mW/cm2 intensity in a cost-effective and portable package. It enables industry to cure UV adhesives that respond to long wave UV-A wavelengths between 360nm and 380nm efficiently, economically and easily.
16th August 2018

Improving sustainability in production with solvent-free activators

Improving sustainability in production with solvent-free activators
DELO has developed two new activators accelerating the adhesion build-up of metal adhesives such as DELO-ML. They allow speeding up production even without containing solvents, which simplifies work safety measures. Activators reduce the curing time of metal adhesives, which achieve their strength under exclusion of oxygen. However, in contrast to metal adhesives or other reaction adhesives, most activators contain solvents.
16th August 2018

High tensile epoxy adhesive utilises renewable biomaterial

High tensile epoxy adhesive utilises renewable biomaterial
Master Bond EP70CN is a two part, thermally stable epoxy adhesive formulated using a natural, renewable and sustainable ingredient. This epoxy system forms high physical strength bonds and can be utilised for bonding, sealing, coating and potting. 
7th August 2018

Epoxy adhesive for structural bonding features long pot life

Epoxy adhesive for structural bonding features long pot life
Master Bond EP21ND-LP was created for structural bonding applications involving large surface areas. It has a long working life of 2-4 hours at 75°F for a 100g mass. Its smooth paste consistency makes it convenient to apply and use. Shore D hardness is 70-80 when mixed in a one to one mix ratio by weight or volume. Moreover, certain properties of the epoxy can be altered by adjusting the mix ratio.
23rd July 2018

Polyimide labels can survive extreme high temperatures

Polyimide labels can survive extreme high temperatures
It has been announced that TE Connectivity (TE) is promoting its very high temperature T1K, T2K and TSK labels. The white self-adhesive labels are suited for identifying components and assemblies that will undergo high temperature processes, environments such as soldering on printed circuit boards (PCB), or long periods at elevated temperatures.
16th July 2018

Adhesive featuring low coefficient of thermal expansion

Adhesive featuring low coefficient of thermal expansion
It has been announced that Master Bond EP30LTE-2 has been developed for joining dissimilar substrates exposed to thermally or mechanically induced stresses. It can be used for sealing, coating and encapsulating, especially for small to medium sized castings where a very low coefficient of thermal expansion (CTE) is required. 
11th July 2018

Reducing production costs of flexible adhesive with precision dispensing

Reducing production costs of flexible adhesive with precision dispensing
In this case study Techsil provided Speed Plastics with a flexible silicone adhesive and a dispensing solution in the manufacture of a smoke hood.
19th June 2018


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