Adhesives

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How to achieve bubble-free mixing

How to achieve bubble-free mixing
  There are many industrial processes which require fast mixing of liquids, pastes and powders, and where the uniformity and homogeneity of these mixes is vital.  These include adhesives, inks, cosmetics, pharmaceuticals, sealants, LED phosphors, nanoparticles, dental materials and more.
7th November 2019

New compact LED UV curing flood lamp announced

New compact LED UV curing flood lamp announced
To give manufacturers all the benefits of curing using UV LED technology in a compact, all-in-one design, adhesives specialist Intertronics now offers the Dymax BlueWave AX-550 LED UV curing flood lamp. The lamp offers rapid curing and consistency across a 125x125mm curing area and can sit on a benchtop or be integrated into an automated production line.
28th October 2019

New epoxy foam for void-filling applications

New epoxy foam for void-filling applications
Robnor ResinLab, formulator of epoxy and polyurethane resin systems, has announced the launch of a brand-new development material, PX19-GE3259-03. This epoxy foam offers good adhesion to a wide variety of substrates. The two-component epoxy system is particularly suitable for void-filling applications and has good compressive strength for backfilling of parts. 
7th October 2019


Optically clear flexible adhesive for bonding displays

Optically clear flexible adhesive for bonding displays
Techsil has launched a new optically clear, low viscosity, UV curable adhesive into the UK market. Manufactured by Panacol, Vitralit 50004 is a one-component acrylic adhesive so it requires no mixing. The adhesive has been designed to use for bonding display screens and laminating optics.
7th October 2019

New thermally conductive adhesives in practical packaging

New thermally conductive adhesives in practical packaging
Intertronics has added three products to its extensive range of thermally conductive adhesives from its partner Polytec PT. Users will benefit from convenient side-by-side cartridge packaging, which simplifies application. The adhesives have added functionality, including high thermal conductivity (2.2W/mK), very good adhesion, flexibility and high temperature resistance.
23rd September 2019

Fast curing in any shape with liquid sealants

Fast curing in any shape with liquid sealants
DELO has introduced a new, silicone-free liquid sealant for the automotive, electronics, and white goods industries. Curing by light, DELO PHOTOBOND SL4165 protects from dust, air, and water. The flow-resistant, highly viscous liquid sealant can be applied in the desired height and any geometric shape. 
29th August 2019

Low temperature adhesives for high reliability electronics

Low temperature adhesives for high reliability electronics
MacDermid Alpha Electronics Solutions has launched the ALPHA HiTech series of Underfills, Cornerfills, and Low Temperature Adhesives for increased reliability of assembled electronic packages. ALPHA HiTech Low Temperature Adhesives are one component, halogen-free, heat-cured formulations supporting processing as low as 80°C.
22nd August 2019

Tips for precise dispensing of small amounts of two-part adhesives

Tips for precise dispensing of small amounts of two-part adhesives
When dispensing small amounts of two-part adhesives or other materials, two key considerations are whether the material is mixed correctly and the accuracy of the amount dispensed. Here Paul Whitehead, Key Account Manager at Intertronics, shares his thoughts on the precise metering, mixing and dispensing of small amounts of two-part materials.
21st August 2019

Thermally printable 50-micron polyester rating label introduced

Thermally printable 50-micron polyester rating label introduced
TE Connectivity (TE), a world leader in connectivity and sensors, has introduced new self-adhesive polyester rating labels, PR115. These custom-designed labels have UL969 category PGJI2 file MH29684 approval, which means that they can be printed by end-use product manufacturers using thermal transfer equipment. 
19th August 2019

Epoxy potting compound with quality flow properties

Epoxy potting compound with quality flow properties
Techsil have launched a new potting compound for electronics with medium viscosity and small filler particle size: Structalit 5894-1 is the perfect choice for large-volume potting or glob top sealing of power electronics. Structalit 5894-1 is a black, one part epoxy resin which requires no mixing.
8th August 2019


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