Featuring a combination of thermal conductivity and electrical insulation properties, Master Bond Supreme 3CCM-85 is a single component epoxy initially designed for glob top and chip coating applications. However, this system can also be utilised for encapsulation and bonding. Supreme 3CCM-85 cures within two to three hours at 80-85°C, which is advantageous for use on heat sensitive components and substrates.
Two component epoxy, Master Bond EP88FL, is a highly flexible, optically clear compound formulated for bonding, coating, sealing, potting and encapsulation. It is easy to use, with a mixing ratio of one to one by weight or volume.
Momentive have just published two new product selection guides for their aerospace silicone adhesive sealants. They are ‘Silicone RTVs for Low Outgassing Applications’, advanced silicones that deliver outstanding performance with minimal outgassing, and ‘Silicone RTV’s for Thermal Protection Systems’, a broad range of advanced silicone RTVs that can perform in the most extreme conditions.
Microdispensing in the electronics industry can help to increase the service life of individual components. Glob Top Potting, for example, protects sensitive components, usually semiconductor chips, from mechanical stresses such as vibrations or temperature fluctuations. It also protects them from external environmental influences such as moisture or corrosion. A viscous resin matrix is applied, mostly an epoxy resin adhesive.
The UK adhesives supplier, Techsil, has launched a range of new adhesive products with low ion content which cure with UV, visible light or moisture. Developed by manufacturers Panacol, these products were specially formulated for applications in the electronics and consumer electronics industry, where heat sensitive parts need to be assembled.
A light fixation for two-component epoxy resins has been introduced by DELO. Thanks to this hybrid chemistry, users benefit from faster, less complex production processes and simplified logistics. DELO-DUOPOX DB8989 provides high speed for a two-component epoxy resin, securing the components against slipping in just a couple of seconds.
A new development in the effort to achieve high-volume inlay manufacturing has been announced by DELO Industrial Adhesives, Mühlbauer and Impinj. The three RAIN RFID companies have successfully teamed to deliver DELO MONOPOX AC6545, supporting the high-speed assembly of copper-bonded RFID chips such as the Impinj Monza 6 family on Mühlbauer high speed assembly lines.
It has been announced that Ellsworth Adhesives are now taking orders for the newly-launched Dowsil (Dow) EI-2888 Primerless Silicone Encapsulant. Dowsil EI-2888 is an optically clear encapsulant designed for professional LED lighting applications. The 100% silicone encapsulant provides LEDs with essential protection from moisture and surface contaminants.
At the Battery Show Europe 2019 (Hall 1, Stand 349), Dow introduced the new DOWSIL EC-6601 Electrically Conductive Adhesive, a next-generation material engineered for reliable performance and electromagnetic compatibility (EMC) in demanding electrical and electronics applications in the transportation, communications and consumer markets.