Adhesives

Displaying 1 - 10 of 175

Low viscosity thermally conductive underfill epoxy

Low viscosity thermally conductive underfill epoxy
Master Bond EP3UF-1 is a new single component epoxy that is not premixed and frozen. Due to its low viscosity of 5,000-15,000 cps, this heat curable thixotropic compound is suited for underfill and many bonding applications. EP3UF-1 delivers high bond strength and dimensional stability with a compressive strength of 18,000-20,000 psi and a tensile modulus of 450,000-500,000 psi.
17th January 2019

High thermal conductivity die and component attach adhesive

High thermal conductivity die and component attach adhesive
Global supplier of electronic materials, Engineered Material Systems, for circuit assembly applications, has debuted its TM-6520 low temperature cure adhesive. Designed for die attach and general circuit assembly applications, the adhesive is electrically insulating and offers high thermal conductivity.
16th January 2019

Challenges in handling highly filled and abrasive materials

Challenges in handling highly filled and abrasive materials
When it comes to electrically conductive materials, we are dealing with dispersions. They are generally referred to as electrically conductive adhesives, silicones or inks. The materials are divided into different areas: Epoxy resins, polyurethanes, silicones and acrylates. Epoxy resins in particular stand out due to their processing and material properties.
16th January 2019


Webinars on adhesive bonding

Webinars on adhesive bonding
A new webinar program has been published by DELO. After addressing basic topics, such as adhesive-friendly design, last year, the Webinars in 2019 will focus on areas such as structural bonding and e-mobility. Adhesive bonding is considered the joining technology of the 21st century and allows for light-weight construction, miniaturisation, and multi-material design.
15th January 2019

A strong bond for manufacturers

A strong bond for manufacturers
Although plasma rarely occurs naturally on Earth, we can still see it in our everyday lives. Lightning, the Northern Lights and the Sun are examples of naturally occurring plasma. Here Peter Swanson, Managing Director of adhesives specialist Intertronics, has explained how manufacturers can use plasma treatment to alter the surface properties of substrates and increase the adherent forces they generate with adhesives and coatings.
18th December 2018

Structural adhesive for construction in aircraft interiors

Structural adhesive for construction in aircraft interiors
Demand for commercial aircraft is booming worldwide. The new flame-retardant structural adhesive, DELO-DUOPOX AB8162, makes production faster. No other industry relies as heavily on lightweight design as aviation does. On the one hand, optimum strength is crucial, on the other hand, weight must be kept to a minimum. DELO has developed its new, two-component epoxy resin especially for lightweight structural joints in aircraft interiors, focusing on fast build-up of strength.
6th December 2018

One component glob top epoxy meets NASA low outgassing specifications

One component glob top epoxy meets NASA low outgassing specifications
A new single component epoxy that is not premixed and frozen, has been introduced by Master Bond with the EP17HTND-CCM. It is more convenient to handle, apply and store than typical two component glob top systems. This black, heat curable compound has a flowable paste consistency suited for glob top, chip coating and bonding applications. 
28th November 2018

Structural Adhesive Offers High Temperature Stability

Structural Adhesive Offers High Temperature Stability
DELO has developed a structural adhesive that offers increased stability at high temperatures. DELO MONOPOX HT2860 achieves up to three times the strength at a temperature of 150°C compared to previous product generations.
24th October 2018

Epoxy for bonding composite substrates

Epoxy for bonding composite substrates
Techsil has developed a new clear, epoxy adhesive called EP25880 Clear that provides a bond on carbon fibre composite parts. Techsil’s Application Engineer Steve Green explained: “I have been working with a number of companies that were manufacturing and assembling products made of composite materials and a need arose to find a product that could bond carbon fibre parts quickly and neatly. There are expensive adhesives on the market but these were reported to be not that easy to work with. Techsil was able to develop a bespoke cost effective 1:1 epoxy formulation that is clear and cures in five minutes.”  
11th October 2018

Two component epoxy with thermal shock resistance

Two component epoxy with thermal shock resistance
Master Bond EP110F8-3 is a two part epoxy system ideal for sealing, encapsulating, potting, and casting applications. “This toughened system provides very good flexibility and possesses a relatively high elongation of 120-150%”, said Rohit Ramnath, Senior Product Engineer. “It offers a low tensile modulus of around 5,000-15,000 psi and a shore A hardness of 40-50 at room temperature."
10th September 2018


Adhesives documents


Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

LOPEC 2019
19th March 2019
Germany Messe Munchen