Adhesives

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Fast curing in any shape with liquid sealants

Fast curing in any shape with liquid sealants
DELO has introduced a new, silicone-free liquid sealant for the automotive, electronics, and white goods industries. Curing by light, DELO PHOTOBOND SL4165 protects from dust, air, and water. The flow-resistant, highly viscous liquid sealant can be applied in the desired height and any geometric shape. 
29th August 2019

Low temperature adhesives for high reliability electronics

Low temperature adhesives for high reliability electronics
MacDermid Alpha Electronics Solutions has launched the ALPHA HiTech series of Underfills, Cornerfills, and Low Temperature Adhesives for increased reliability of assembled electronic packages. ALPHA HiTech Low Temperature Adhesives are one component, halogen-free, heat-cured formulations supporting processing as low as 80°C.
22nd August 2019

Tips for precise dispensing of small amounts of two-part adhesives

Tips for precise dispensing of small amounts of two-part adhesives
When dispensing small amounts of two-part adhesives or other materials, two key considerations are whether the material is mixed correctly and the accuracy of the amount dispensed. Here Paul Whitehead, Key Account Manager at Intertronics, shares his thoughts on the precise metering, mixing and dispensing of small amounts of two-part materials.
21st August 2019


Thermally printable 50-micron polyester rating label introduced

Thermally printable 50-micron polyester rating label introduced
TE Connectivity (TE), a world leader in connectivity and sensors, has introduced new self-adhesive polyester rating labels, PR115. These custom-designed labels have UL969 category PGJI2 file MH29684 approval, which means that they can be printed by end-use product manufacturers using thermal transfer equipment. 
19th August 2019

Epoxy potting compound with quality flow properties

Epoxy potting compound with quality flow properties
Techsil have launched a new potting compound for electronics with medium viscosity and small filler particle size: Structalit 5894-1 is the perfect choice for large-volume potting or glob top sealing of power electronics. Structalit 5894-1 is a black, one part epoxy resin which requires no mixing.
8th August 2019

Top tips for a successful UV curing process

Top tips for a successful UV curing process
  Manufacturers often choose light curing materials for assembly applications because of their bonding effectiveness, rapid cure time and process efficiencies. With so many adhesives and so much equipment on the market, where should manufacturers start? Here Peter Swanson, Managing Director at Intertronics, shares three tips for manufacturers operating UV curing processes.
5th August 2019

Microcare general purpose cleaner joins portfolio

Microcare general purpose cleaner joins portfolio
The versatile new Microcare General Purpose Cleaner and Adhesive Remover is now available to order from Ellsworth Adhesives Europe. The multi-purpose cleaning system replaces the discontinued Slow Drying Flux remover (MCC-E7M) due to high demand.
2nd August 2019

Toughened epoxy polysulfide hybrid offers chemical resistance

Toughened epoxy polysulfide hybrid offers chemical resistance
Master Bond EP21TP-2NV is a two part epoxy polysulfide hybrid formulated for use as an adhesive, sealant and potting system. It withstands prolonged exposure to many harsh chemicals including fuels, oils, hydrocarbons and hydraulic fluids. It is also fully RoHS compliant, meeting RoHS3 Directive (EU) 2015/863. 
22nd July 2019

Non-premixed one part epoxy for chip coating

Non-premixed one part epoxy for chip coating
Featuring a combination of thermal conductivity and electrical insulation properties, Master Bond Supreme 3CCM-85 is a single component epoxy initially designed for glob top and chip coating applications. However, this system can also be utilised for encapsulation and bonding. Supreme 3CCM-85 cures within two to three hours at 80-85°C, which is advantageous for use on heat sensitive components and substrates. 
2nd July 2019

Low viscosity epoxy system features high flexibility

Low viscosity epoxy system features high flexibility
Two component epoxy, Master Bond EP88FL, is a highly flexible, optically clear compound formulated for bonding, coating, sealing, potting and encapsulation. It is easy to use, with a mixing ratio of one to one by weight or volume. 
2nd July 2019


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