Adhesives

Displaying 171 - 180 of 188

Bonding technique features high tensile strength

Bonding technique features high tensile strength
A ceramic-to-ceramic bonding technique, suitable for use in demanding and high-pressure fluid handling and vacuum applications, has been released by Morgan. Using a preparatory formulation applied to one or both faces of the parts to be joined, the bonding technique delivers high tensile strength.
17th July 2014

Vacuum-bonding technology for more fragile TFT generation

Vacuum-bonding technology for more fragile TFT generation
  A vacuum-bonding assembly technology for TFT display structures, touchscreens and front glasses, has been introduced by Distec. VacuBond is suitable for the latest TFT generation which is more fragile than the last. 
16th July 2014

Optical bonding service for low volume displays

Optical bonding service for low volume displays
andersDX announced a comprehensive and highly affordable optical bonding service, to enhance the readability of displays in sunlit environments, especially out of doors. andersDX is aiming specifically at customers whose volumes in the past would have been too low to make optical bonding economic, offered on displays of 2.8-23.6” sizes with a very low minimum order quantity.
25th June 2014


Two Component, Thermally Conductive Epoxy Resists High Temperatures

Master Bond EP46HT-1AO is formulated for bonding and sealing applications, is widely used in the aerospace, electronic and specialty OEM industries. Unlike most conventional two component epoxies, EP46HT-1AO cures with the addition of heat, which allows it to have a working life exceeding 24 hours. It has a forgiving 100 to 30 mix ratio by weight and bonds well to metals, composites, glass, ceramics and many plastics.
19th June 2014

Brochure details adhesives for medical device assembly

Brochure details adhesives for medical device assembly
A brochure detailing adhesives and protective materials for medical device assembly has been issued by Intertronics. The brochure focuses on Intertronic's ISO 10993 and USP Class VI adhesives and protective materials, with products including DYMAX medical grade adhesives, coatings and masking materials, Opti-tec epoxy adhesives, medical grade cyanoacrylates and the Polytec PT range of two-part adhesives.
27th May 2014

Sealant reduces cycle times and manufacturing costs

Hodgson Sealants has used its in-house R&D facility to help local company, Paneltex, increase manufacturing efficiency and improve the speed of its production process. Hodgson Sealants completed a full technical audit of Paneltex’s sealing processes on site and then carried out further tests at its state of the art laboratory.
6th May 2014

Epoxy adhesive cures as low as 110°C

Epoxy adhesive cures as low as 110°C
  Formulated for disk drive, camera module, optoelectronic and circuit assembly applications, Engineered Material Systems has announced the 535-10M-49 UV cured epoxy adhesive. The material contains a secondary thermal cure initiator that cures as low as 110°C for shadowed areas.
3rd April 2014

Adhesive reliably bonds RFID chips and antennas

Adhesive reliably bonds RFID chips and antennas
Providing reliable transmission of electrical signals, the anisotropic conductive DELOMONOPOX AC245 adhesive has been introduced by DELO Industrial Adhesives. Suitable for the reliable bonding of RFID chips and antennas, it offers high long-term die shear strength and enables efficient production as it can be jetted.
3rd April 2014

Epoxy meets NASA low outgassing specifications

Epoxy meets NASA low outgassing specifications
Suitable for bonding, sealing, coating and encapsulation applications in the aerospace, electronic, optical and optoelectronic industries, EP30-3LO is a two component epoxy system from Master Bond. The epoxy offers optical clarity, high temperature resistance, and meets NASA specifications for low outgassing.
1st April 2014

Optical bonding improves display readability

Optical bonding improves display readability
Believed to be the world's most advanced optical bonding technology, Distec uses the VacuBond high performance silicone optoGel. The manufacturing equipment is capable of directly bonding TFT displays in custom bezels and front housings with integrated protective glass. Moreover, the VacuBond process is reversible: individual components can be recovered, simplifying repairs and reducing repair costs.
27th March 2014


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