Adhesives

Displaying 11 - 20 of 206

Glob Top dispensing to spray continuously and precisely

Glob Top dispensing to spray continuously and precisely
Microdispensing in the electronics industry can help to increase the service life of individual components. Glob Top Potting, for example, protects sensitive components, usually semiconductor chips, from mechanical stresses such as vibrations or temperature fluctuations. It also protects them from external environmental influences such as moisture or corrosion. A viscous resin matrix is applied, mostly an epoxy resin adhesive.
20th June 2019

Electronics adhesives that cure with UV

Electronics adhesives that cure with UV
The UK adhesives supplier, Techsil, has launched a range of new adhesive products with low ion content which cure with UV, visible light or moisture. Developed by manufacturers Panacol, these products were specially formulated for applications in the electronics and consumer electronics industry, where heat sensitive parts need to be assembled.
17th June 2019

One component epoxy features thermal cycling resistance

One component epoxy features thermal cycling resistance
  The Master Bond Supreme 17HT is a single component, no mix epoxy system for bonding and sealing applications featuring an unlimited working life at room temperature.
20th May 2019


Light fixation for two-component epoxy resins

Light fixation for two-component epoxy resins
A light fixation for two-component epoxy resins has been introduced by DELO. Thanks to this hybrid chemistry, users benefit from faster, less complex production processes and simplified logistics. DELO-DUOPOX DB8989 provides high speed for a two-component epoxy resin, securing the components against slipping in just a couple of seconds.
16th May 2019

Efficient RAIN RFID label manufacturing

Efficient RAIN RFID label manufacturing
A new development in the effort to achieve high-volume inlay manufacturing has been announced by DELO Industrial Adhesives, Mühlbauer and Impinj. The three RAIN RFID companies have successfully teamed to deliver DELO MONOPOX AC6545, supporting the high-speed assembly of copper-bonded RFID chips such as the Impinj Monza 6 family on Mühlbauer high speed assembly lines.
14th May 2019

Primerless silicone encapsulant now available

Primerless silicone encapsulant now available
It has been announced that Ellsworth Adhesives are now taking orders for the newly-launched Dowsil (Dow) EI-2888 Primerless Silicone Encapsulant. Dowsil EI-2888 is an optically clear encapsulant designed for professional LED lighting applications. The 100% silicone encapsulant provides LEDs with essential protection from moisture and surface contaminants. 
14th May 2019

EMI shielding solutions with electrically-conductive adhesive

EMI shielding solutions with electrically-conductive adhesive
At the Battery Show Europe 2019 (Hall 1, Stand 349), Dow introduced the new DOWSIL EC-6601 Electrically Conductive Adhesive, a next-generation material engineered for reliable performance and electromagnetic compatibility (EMC) in demanding electrical and electronics applications in the transportation, communications and consumer markets.
9th May 2019

Dual curing epoxy meets biocompatibility requirements

Dual curing epoxy meets biocompatibility requirements
A single component, nanosilica filled compound featuring a UV and heat curing mechanism has been released by Master Bond, with the UV22DC80-1Med. Not only does it pass USP Class VI Tests for biocompatibility, but it also meets ISO 10993-5 for cytotoxicity, making it ideal for many applications in the medical device industry. 
24th April 2019

Adhesives dispensing expertise shared at FAST Live

Adhesives dispensing expertise shared at FAST Live
To help the industry better tackle the challenges of technology and manufacturing using adhesives and protective materials, Peter Swanson, Managing Director at adhesives specialist Intertronics, ran a seminar at FAST Live. Swanson offered insights into dispensing technology, process validation and the latest positive displacement and jetting technologies.
15th April 2019

Electrically conductive adhesives at Intersolar Europe

Electrically conductive adhesives at Intersolar Europe
Global supplier of conductive interconnect materials, Engineered Material Systems, will exhibit in Hall C1, booth 354 at the Intersolar Europa Solar Power Expo, scheduled to take place May 15th to 17th, 2019 in Munich, Germany. Company representatives will show next-generation low-cost electrically conductive adhesives for stringing, shingling and back contact applications in crystalline silicon and heterojunction solar modules.
12th April 2019


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