Adhesives

Displaying 11 - 20 of 188

Growing adhesives firm opens new facility

Growing adhesives firm opens new facility
To deliver better customer service and accommodate further growth, Intertronics has opened a new facility in Kidlington. Inaugurated on 25th February 2019, the building provides increased warehouse space to enable next day delivery, an enhanced office area to house its growing team and a new Technology Centre to give customers greater access to Intertronics’ equipment and expertise.
25th February 2019

Biocompatible, nanosilica filled LED curable adhesive

Biocompatible, nanosilica filled LED curable adhesive
The LED curing adhesive system from Master Bond, the LED405Med, meets ISO 10993-5 cytotoxicity requirements for use in medical device assembly. LED405Med is optically clear, with a refractive index of 1.50, and offers excellent light transmission properties. This electrically insulative system features a high volume resistivity of more than 1014 ohm-cm and a low dielectric constant of 4.2 at 60Hz.
4th February 2019

Highly filled adhesives feature good dispensing properties

Highly filled adhesives feature good dispensing properties
Fillers in adhesives, potting compounds and encapsulants can lead to mechanical abrasion in dispensing systems. Despite such potentially abrasive behaviour, the adhesives can be dispensed reliably and precisely over the long term. This is the result of experimental tests performed by ViscoTec and DELO Industrial Adhesives, covering more than 6 million dispensing cycles.
24th January 2019


Low viscosity thermally conductive underfill epoxy

Low viscosity thermally conductive underfill epoxy
Master Bond EP3UF-1 is a new single component epoxy that is not premixed and frozen. Due to its low viscosity of 5,000-15,000 cps, this heat curable thixotropic compound is suited for underfill and many bonding applications. EP3UF-1 delivers high bond strength and dimensional stability with a compressive strength of 18,000-20,000 psi and a tensile modulus of 450,000-500,000 psi.
17th January 2019

High thermal conductivity die and component attach adhesive

High thermal conductivity die and component attach adhesive
Global supplier of electronic materials, Engineered Material Systems, for circuit assembly applications, has debuted its TM-6520 low temperature cure adhesive. Designed for die attach and general circuit assembly applications, the adhesive is electrically insulating and offers high thermal conductivity.
16th January 2019

Challenges in handling highly filled and abrasive materials

Challenges in handling highly filled and abrasive materials
When it comes to electrically conductive materials, we are dealing with dispersions. They are generally referred to as electrically conductive adhesives, silicones or inks. The materials are divided into different areas: Epoxy resins, polyurethanes, silicones and acrylates. Epoxy resins in particular stand out due to their processing and material properties.
16th January 2019

Webinars on adhesive bonding

Webinars on adhesive bonding
A new webinar program has been published by DELO. After addressing basic topics, such as adhesive-friendly design, last year, the Webinars in 2019 will focus on areas such as structural bonding and e-mobility. Adhesive bonding is considered the joining technology of the 21st century and allows for light-weight construction, miniaturisation, and multi-material design.
15th January 2019

A strong bond for manufacturers

A strong bond for manufacturers
Although plasma rarely occurs naturally on Earth, we can still see it in our everyday lives. Lightning, the Northern Lights and the Sun are examples of naturally occurring plasma. Here Peter Swanson, Managing Director of adhesives specialist Intertronics, has explained how manufacturers can use plasma treatment to alter the surface properties of substrates and increase the adherent forces they generate with adhesives and coatings.
18th December 2018

Structural adhesive for construction in aircraft interiors

Structural adhesive for construction in aircraft interiors
Demand for commercial aircraft is booming worldwide. The new flame-retardant structural adhesive, DELO-DUOPOX AB8162, makes production faster. No other industry relies as heavily on lightweight design as aviation does. On the one hand, optimum strength is crucial, on the other hand, weight must be kept to a minimum. DELO has developed its new, two-component epoxy resin especially for lightweight structural joints in aircraft interiors, focusing on fast build-up of strength.
6th December 2018

One component glob top epoxy meets NASA low outgassing specifications

One component glob top epoxy meets NASA low outgassing specifications
A new single component epoxy that is not premixed and frozen, has been introduced by Master Bond with the EP17HTND-CCM. It is more convenient to handle, apply and store than typical two component glob top systems. This black, heat curable compound has a flowable paste consistency suited for glob top, chip coating and bonding applications. 
28th November 2018


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IoT Tech Expo 2019
25th April 2019
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