Engineered Material Systems has introduced its 631-39 UV plus thermal cured adhesive for bonding lens holders in camera module applications. It is designed to adhere to engineered plastics used in lens holder assemblies. These materials are engineered to withstand circuit board reliability test criteria.
The UV cured adhesive will cure rapidly when exposed to intense UV light centered at 365nm. After fixturing with UV, the adhesive can be cured in 15 minutes at 110ºC. The 631-39 is the latest addition to Engineered Material Systems’ extensive line of electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonic applications.