Epoxy provides low coefficient of thermal expansion
Suitable for bonding, sealing, coating and select casting in electronic, aerospace, optical and speciality OEM applications, Master Bond's EP42HT-2LTE is a two component epoxy with a flowable paste consistency enabling precise alignment with minimal fixturing. It has a low coefficient of thermal expansion of 9-12 x 10-6 in/in/°C and can cure at room temperature (or faster with additional heat).
EP42HT-2LTE has a tensile lap shear strength of over 1,200psi and bonds well to a wide variety of similar and dissimilar substrates, including metals, composites, ceramics, glass and many plastics. The epoxy provides superior electrical insulation properties, chemical resistance and dimensional stability, as well as low linear (less than 0.01%) and volumetric (less than 0.1%) shrinkage upon curing. This is particularly useful for potting and encapsulation applications.
Prepared using a non-critical 100 to 40 mix ratio by weight or a 100 to 50 mix ratio by volume, EP42HT-2LTE is available in standard packaging in sizes from half pint to five gallon kits. After mixing a 100g batch, it has a working life of 60 to 90 minutes open time.
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Panasonic PhotoMOS® Photovoltaic MOSFET High-Power Drivers
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| Stock: | 3490 |
| Cost: | $3.95 |
