High strength epoxy targets structural bonding

1st July 2015
Posted By : Nat Bowers
High strength epoxy targets structural bonding

Designed for high performance structural bonding in the aerospace and speciality OEM industries, Master Bond has announced the EP13SPND-2 one part, high temperature resistant epoxy. Featuring an impressive strength profile, EP13SPND-2 offers a tensile lap shear strength, compressive strength and tensile modulus of over 3,000, 18,000 and 500,000-550,000psi.

As a single component system with an unlimited working life at room temperature, this product is easy to handle and does not require mixing prior to use. EP13SPND-2 has a paste consistency for non-drip application and it will not flow when curing.

This dimensionally stable epoxy bonds well to many substrates including metals, glass, ceramics, composites, rubbers and most plastics. Typical cured bond line thickness is 50.8x203.2µm (0.002-0.008").

EP13SPND-2 is a competent electrical insulator and features a volume resistivity exceeding 1014Ω-cm. It resists a variety of chemicals such as fuels, oils, acids, bases and many solvents. This system is serviceable over the wide temperature range from -51.1 to +260°C (-60 to +500°F) and is available for use in pints, quarts, gallons and 5 gallon containers.


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