High thermal conductivity die and component attach adhesive

Posted By : Alex Lynn
High thermal conductivity die and component attach adhesive

Global supplier of electronic materials, Engineered Material Systems, for circuit assembly applications, has debuted its TM-6520 low temperature cure adhesive. Designed for die attach and general circuit assembly applications, the adhesive is electrically insulating and offers high thermal conductivity.

TM-6520 cures in 60 minutes at 70°C or 20 minutes at 100°C with a thermal conductivity of 1.7 W/°K. This material is ideal for applications where the components are temperature sensitive and require a high thermally conductive adhesive for heat dissipation. TM-6520 has a 24-hour work-life and a 15,000cP viscosity at 5rpm for easy needle dispensing.

TM-6520 was developed to pass the rigorous reliability requirements in die attach, disk drive, camera module, photonics and circuit assembly applications. It is the latest addition to Engineered Material Systems’ extensive line of electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonic applications.


You must be logged in to comment

Write a comment

No comments




Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

IoT Tech Expo 2019
25th April 2019
United Kingdom Olympia, London
Ceramics Expo 2019
29th April 2019
United States of America International Exposition Center (I-X Center)
PCIM 2019
7th May 2019
Germany Nürnberg Messe
Electronics & Applications 2019
14th May 2019
Netherlands Jaarbeurs Utrecht Hall 7 Jaarbeursplein
Agile for Automotive 2019
15th May 2019
United States of America Detroit, MI