Component Management

Light curing adhesive targets COC/COP bonding

6th August 2014
Staff Reporter
0

A UV and visible light curing adhesive, particularly suited to rapid bonding of COP/COC, has been introduced by Intertronics. The DYMAX 1072-M MD adhesive bonds COC/COP (cyclic olefin polymers/copolymers) film laminates and other difficult-to-bond-to polymers, as well as a variety of other plastics widely used in the manufacture of medical devices.

The UV/broad-spectrum-cured adhesive has a number of applications including needle assembly, reservoir assembly, transducer assembly and medical potting. Other bondable substrates include stainless steel, PS, PU, PVC, ABS, EVA, PA, PC, PCTG, PEBA, PET, PETG, PI, PMMA, PSU, SAN, TPU, CER, AL and glass.

The adhesive has also been optimised for LED curing lamps, with the adhesive enabling curing n less than 3 seconds after exposure to LED or broad-spectrum UV light. This then enables increased output and the lowering of production costs. Soft and flexible with a durometer of A58, the adhesive has a viscosity of 1,000 cP for improved wetting, making it ideally suited for interfacial bonding requirements. The product is ISO 10993-5 Cytotoxicity approved.


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