New epoxy foam for void-filling applications

7th October 2019
Posted By : Alex Lynn
New epoxy foam for void-filling applications

Robnor ResinLab, formulator of epoxy and polyurethane resin systems, has announced the launch of a brand-new development material, PX19-GE3259-03. This epoxy foam offers good adhesion to a wide variety of substrates. The two-component epoxy system is particularly suitable for void-filling applications and has good compressive strength for backfilling of parts. 

It can also be used in the casting of buoyant materials, or as a machinable epoxy foam for model making. 

The lightweight foam has a low density of approximately 0.25g/cm, which means only a relatively small amount of material is required to fill a large volume. This reduces material waste and makes PX19-GE3259-03 a cost-effective choice. 

Furthermore, PX19-GE3259-03 from Robnor ResinLab offers good thermal performance post-cure and has an operating temperature of up to 150°C. 

With a low viscosity of just 3,000 (when mixed), this new material is very easy to process and work with. The system’s slow foaming reaction generates low pressure during expansion and has a cure time of 24 hours at room temperature. 

Additionally, PX19-GE3259-03 is also available as a three-component system. This allows users to adjust the foam density to suit their specific application requirements. 

Robnor ResinLab PX19-GE3259-03 is RoHS compliant and can be purchased in bulk, twin-packs or 2:1 ratio cartridges.


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