Tapes transfer heat & provide a secure bond
Two thermally conductive tapes that not only allow heat to transfer easily and dissipate quickly but also provide a secure bond have been introduced by Techsil. The Stokvis 202331 and 202332 consist of an acrylic adhesive which contains thermally conductive ceramic particles that transmit heat away from sensitive components.
Featuring a foam-like, compliant interface, the tapes fill any air gaps thereby reducing thermal resistance at the interface. In addition, the Stokvis 202331 and 202332 can accommodate materials of different coefficients of thermal expansion. The double-sided tapes can be used in place of mechanical fasteners and are designed for bonding heat sinks on PCBs, LED strips and IC packages, as well as mounting ICs, GPUs, heat pipes and heat sink assembly.
Along with high thermal conductivity, the Stokvis 202331 and 202332 also offer good heat resistance, age resistance and weatherability. These white, flame retardant acrylic foam tapes are halogen free and perform at intermittent temperatures of up to 150°C, with a continuous service temperature range of -40 and +105°C, which means that electronic components can perform at the upper limits of their operating range for longer periods of time.
The thermal conductivity offered by the Stokvis 202331 is 2W/mK, with a breakdown voltage of 35kV/mm. The tape offers 25N/25mm adhesion on stainless steel and a static shear of 1kg/625mm2. This grade comes in a 0.5mm thickness as standard, however, the Stokvis 202332 provides a thicker alternative at 0.8mm. The Stokvis 202332 offers a high thermal conductivity of 1.2W/mK, with a 30N/25mm adhesion to steel.
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| Cost: | $3.95 |
