Temperature resistant encapsulant for electronic components

6th March 2019
Posted By : Alex Lynn
Temperature resistant encapsulant for electronic components

Manufacturer of industrial adhesives for automotive, consumer and industrial electronics applications, DELO, has developed an encapsulant with very high resistance to media and temperature. DELO MONOPOX GE6515 offers an optimised curing time, speeding up production processes. 

Well suited for encapsulating electronic components in automotive applications, this one component epoxy resin is purely heat-curing. It achieves very high strength even at high temperatures. DELO MONOPOX GE6515 exhibits strength values of 20 MPa on aluminium at 150°C and 14 MPa at 200°C. This new epoxy resin achieves excellent adhesion on a variety of materials, including FR4, PA and copper and is highly resistant to chemicals like oil, acids and fuels.

DELO MONOPOX GE6515 has a coefficient of thermal expansion (CTE) matching that of materials commonly used in the automotive industry. The CTE is 23 ppm/K up to the glass transition temperature (Tg) of 155°C and 48 ppm/K above Tg. A small CTE is especially important for applications where temperature-induced warpage has to be avoided.

Cured in an air convection oven at temperatures ranging from 90°C to 150°C, the epoxy resin is fully cured after just 15 minutes at 130°C, making production processes faster.

DELO MONOPOX GE6515 has a processing time of one week. During this period of time, the encapsulant can be optimally applied to the component. With only 48 hours, the processing time of products typically used for such applications is significantly lower.

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