KEMET releases high temperature soldering study

22nd October 2015
Posted By : Nat Bowers

KEMET has released its study supporting Transient Liquid Phase Sintering (TLPS) materials as an alternative for high temperature lead-based solders.

KEMET Electronics and Ormet Circuits completed a multi-year study focused on the characterisation of high temperature MLCCs using TLPS materials. The objective was to develop a ceramic capacitor component that was both RoHS compliant and had robust reliability in harsh, high temperature operating environments.

The results of the study were presented in a keynote address at the Material and Science Technology Conference held in Columbus, Ohio earlier this month. The presentation can be downloaded on KEMET’s Engineering Center, here. The full publication may also be purchased through Springerlink for a small fee.

Dr. John Bultitude, Vice President and Technical Fellow, KEMET, commented: “KEMET customers want robust products that can thrive in today’s high operating temperatures. Ormet was a natural choice for this study because its TLPS materials are uniquely positioned as a green technology with enabling electrical properties.”


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