KYZEN will exhibit at productronica China next month at the Shanghai New International Expo Centre. KYZEN says it will discuss recent research that points to ways to improve stencil printing reliability. The research strongly supports the need for a wet wipe with an engineered solvent that matches to the flux composition.
The evidence from the study concludes that reliable and acceptable assemblies start with a clean print. In addition, clean prints are more achievable on a reliable basis with engineered solutions, such as CYBERSOLV C8882 than they are with standard IPA. In addition to sharing the results of the stencil reliability research findings, visitors to the KYZEN booth can acquire custom technical support to help reduce misprints and increase production yields at no cost.
CYBERSOLV C8882 will be featured in the KYZEN booth. C8882 is a fast-acting stencil cleaning solvent designed for the under-stencil on printer wipe cleaning process. The solvent dries quickly, eliminating the streaking and smearing experienced with traditional cleaning solvents.