The MoldMan 1050 from Engineering Solution Ltd is a table top, low pressure moulding machine, ideal for encapsulating electronic products from prototyping to small or medium size runs. The machine will be launched in Europe at Southern Manufacturing & Electronics show from February 9th.
With similar capabilities to larger systems, the MoldMan 1050 incorporates an array of new state of the art technology into a compact design with a low overall investment cost. Some of the new MoldMan 1050 features unique in this class of machine include an “On Demand” type heat reservoir which prevents degradation of hotmelt colours and a temperature controlled hopper which helps eliminate material degradation. A footprint of 2’ X 3’ means that it is a true bench top machine and will fit just about any work space.
The MoldMan 1050 has been designed to handle materials in a very efficient manner, with its unique “On Demand” type heat reservoir and “Temperature Controlled Hopper”. This system liquefies a minimal amount of material prior to injection into the mould to reduce material degradation.
Just like the big systems, a pressure feedback transducer monitors pressure of the material delivery to the cavity to better regulate pressure accuracy, for specific requirements of electronic components and PCBs. A Nitrogen blanket option is available to increase material “Pot Life” and pressurize the system. Nitrogen displaces oxygen, extending the life of the material, as well as pressurizing material into the pump, increasing consistency, improving the material flow rate.
The MoldMan 1050 can process materials with a viscosity of up to 60,000 cPs (Centipoise). All MoldMan Machines are designed to be configurable and used for multiple applications. A world class machine, the MM1050 has all the capabilities to be used for more than one type of project.