At the 2014 NPI Awards, in the category of Component Placement – Multi-function, Essemtec took home the award for its multi-functional SMT Center. The award was presented to the company during a Tuesday, March 25, 2014 ceremony that took place at the Mandalay Bay Convention Center during the IPC APEX EXPO.
The multi-functional SMT center Paraquda meets all the requirements of a modern, highly flexible production system - changeover without downtime, component management, and the integration of jet printing of solder paste or glue. Paraquda combines two different production steps within one machine platform (solder paste jetting and SMD assembly). With this unique combination, the multifunctional center allows an unprecedented flexibility in the market.
Essemtec’s solder jet printer is fast (up to 80,000 dots/hr), very precise (51µm @3σ) and suitable for 0201 components. So far, jetting of solder pastes was possible only with limitations – electronics manufacturers needed to buy specially designed, costly solder pastes. The new system from Essemtec opens the range of pastes to most type 4, 5, 6 or 7 pastes. Essemtec’s solder paste jet valve can be installed on existing machines platforms, such as the Scorpion high-speed jet dispenser or the Paraquda component placer. Production is fully automated, and solder paste application and component placement are seamlessly integrated while process monitoring ensures high-quality results.
Premiering in 2008, the NPI Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.