Nihon Superior has been awarded a 2017 NPI Award for its SN100CV P506 D4 Lead-Free Solder Paste. The award was presented to the company’s President, Tetsuro Nishimura during the IPC APEX EXPO.
SN100CV P506 D4 is a lead-free, no-clean solder paste with a basic composition of (Sn-Cu-Ni+Ge+Bi). This new alloy has an addition that enables thermally stable solder joints even after thermal cycling. Unlike silver-containing alloys that derive their strength from a dispersion of fine particles of eutectic Ag3Sn, SN100CV gains its strength from solute atoms in the tin matrix of the joint. The unique ability of SN100CVP506 D4 to survive long-term storage at room temperature allows simplification of stock management while meeting all the requirements of modern reflow soldering processes.
Premiering in 2008, the NPI Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.