Analysis

Nordson ASYMTEK at SMT Hybrid Packaging

20th April 2016
Peter Smith
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Nordson ASYMTEK is to present a triple-valve, closed-loop system to jet conformal coating, a UV oven to cure it, and an automated coating inspection system to verify the coating results in the SmartTec stand at SMT Hybrid Packaging.

Nordson ASYMTEK’s Quantum Q-6800 high-performance, large-format dispensing system will jet underfill as part of the show’s Future Packaging Line at stand 6-434. Demonstrations include the new NexJet 8 and IntelliJet jet valves with the ReadiSet Jet Cartridge. The NexJet 8 handles abrasive fluids, has a long wear life, and dispenses consistent dot volumes for a wide range of fluids used in microelectronics manufacturing.

The IntelliJet is a piezo jet that dispenses small dot sizes at high frequencies without compromising the precision, high yield, and long-term reliability needed for flip chip underfill and advanced semiconductor packaging applications. The IntelliJet advances piezojetting technology with long-term reliability up to 3 times longer than other piezo-driven jets. Both jets use Nordson ASYMTEK’s ReadiSet 2-piece jet cartridge that is fast and easy to clean. Its short fluid path minimizes fluid waste and clogging.

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