Partnership for injection molded structural electronics

16th April 2019
Source: TactoTek
Posted By : Alex Lynn
Partnership for injection molded structural electronics

An agreement has been signed by BÖ-LA and TactoTek, for BÖ-LA to market and sell injection molded structural electronics (IMSE) solutions. This partnership brings together the companies in order to advance the market for integrating electronic functionality within molded plastics. 

“The vast majority of our IMSE customer cases are for user interfaces that require flawless cosmetics. BÖ-LA’s film-insert molding skill is recognised by leaders in automotive, appliance and electronics markets as consistently meeting the highest standards,” said Sini Rytky, TactoTek VP, Product Management. “With their close customer relationships and deep technical knowledge that includes printed electronics, BÖ-LA is in an ideal position to determine the best fit of technologies for each customer project.”

BÖ-LA has a distinguished reputation for technology innovation and has specific expertise in delivering high quality cosmetic surfaces, technical screen printing, illumination and film-insert-molding (FIM) which is also known as in-mold labelling (IML).

According to Dirk Lange, Head of Sales, at BÖ-LA, added: “We have been actively involved in developing and commercialising techniques for adding electronic functions to cosmetic surfaces, including integrating printed electronics in 3D-formed FIM parts. With TactoTek’s IMSE technology, we can also integrate electronic components within these molded structures which increases integrated functionality and streamlines production for the right designs.”


You must be logged in to comment

Write a comment

No comments




Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

Sensor+Test 2019
25th June 2019
Germany Nürnberg Messe
DSEI 2019
10th September 2019
United Kingdom EXCEL, London
European Microwave Week 2019
29th September 2019
France Porte De Versailles Paris
Engineering Design Show 2019
16th October 2019
United Kingdom Ricoh Arena, Coventry
ELIV 2019
16th October 2019
Germany Bonn World Conference Center