Exhibiting at National Electronics Week ADEC Expo South Africa, Gen3 Systems and their South African distributor, Quamba Technologies, will be displaying the Gensonic stencil cleaning system. This cleaning system was named as the European Product of the Year, at productronica 2013.
The Gensonic stencil cleaning system is a manually operated ultrasonic transducer unit for cleaning stencil apertures. It can be used in conjunction with our Stencil Cleaning Centres, or it is portable enough to be taken directly to the printer. This significantly reduces production downtime and printer resetting. This simple and safe to use cleaning system offers zero risk of stencil damage and a typical three minute cleaning cycle. Suitable for both stainless steel and plastic stencils, the Gensonic system cleans solder paste or SMD adhesives and accepts both foils and framed stencils.
In a technical paper titled ‘Cleanliness of Stencils and Cleaned Misprint Circuit Boards – Précis', Dr. Beverley Christian, Director, Materials Lab, Blackberry, commented: “Solder pastes, especially lead-free pastes tend to become compacted and trap particles, blocking fine apertures and deforming aperture corners. Using proven industry cleaning solution and the Gensonic ultra-sonic transducer directly on the stencil, even the smallest tightest pitch apertures can be cleared and perfectly cleaned. Many users have found that their conventional cleaning systems are 80-90% effective, leaving the smallest, most sensitive apertures partially occluded. Using the Gensonic these apertures can be cleared and renewed. This system is effective as a localised cleaner, applied during the print cycle while the stencil is in the printer, preventing expensive and time-consuming shutdowns required to clean problem apertures.”
Scheduled to take place March 11-12, 2014 at the Gallagher Convention Centre in Midrand, Johannesburg, Gen3 will also present a number of other products at the show. These include: Ionic Contamination Systems, also known as the CM Series, Dip and Spray Coating Systems, Wizard Thermal Profiling, SIR and CAF Testing Systems, Solderability Testing, Solder Dross Recovery and Solder Paste Inspection.