Master Bond Inc

Address:
154 Hobart St
07601
United States of America

Phone: 201-343-8983

Fax: 201-343-2132

Web: www.masterbond.com


Master Bond Inc articles

Displaying 1 - 20 of 80

One component epoxy features thermal cycling resistance

One component epoxy features thermal cycling resistance
  The Master Bond Supreme 17HT is a single component, no mix epoxy system for bonding and sealing applications featuring an unlimited working life at room temperature.
20th May 2019

Dual curing epoxy meets biocompatibility requirements

Dual curing epoxy meets biocompatibility requirements
A single component, nanosilica filled compound featuring a UV and heat curing mechanism has been released by Master Bond, with the UV22DC80-1Med. Not only does it pass USP Class VI Tests for biocompatibility, but it also meets ISO 10993-5 for cytotoxicity, making it ideal for many applications in the medical device industry. 
24th April 2019

Graphene filled epoxy offers thermal conductivity

Graphene filled epoxy offers thermal conductivity
The newly introduced EP30NG from Master Bond is a two part epoxy adhesive system developed for applications that require high thermal conductivity. It contains a specialty graphene filler which contributes not only to its high compressive strength, but also to its enhanced dimensional stability. 
5th April 2019


Biocompatible, nanosilica filled LED curable adhesive

Biocompatible, nanosilica filled LED curable adhesive
The LED curing adhesive system from Master Bond, the LED405Med, meets ISO 10993-5 cytotoxicity requirements for use in medical device assembly. LED405Med is optically clear, with a refractive index of 1.50, and offers excellent light transmission properties. This electrically insulative system features a high volume resistivity of more than 1014 ohm-cm and a low dielectric constant of 4.2 at 60Hz.
4th February 2019

Low viscosity thermally conductive underfill epoxy

Low viscosity thermally conductive underfill epoxy
Master Bond EP3UF-1 is a new single component epoxy that is not premixed and frozen. Due to its low viscosity of 5,000-15,000 cps, this heat curable thixotropic compound is suited for underfill and many bonding applications. EP3UF-1 delivers high bond strength and dimensional stability with a compressive strength of 18,000-20,000 psi and a tensile modulus of 450,000-500,000 psi.
17th January 2019

One component glob top epoxy meets NASA low outgassing specifications

One component glob top epoxy meets NASA low outgassing specifications
A new single component epoxy that is not premixed and frozen, has been introduced by Master Bond with the EP17HTND-CCM. It is more convenient to handle, apply and store than typical two component glob top systems. This black, heat curable compound has a flowable paste consistency suited for glob top, chip coating and bonding applications. 
28th November 2018

UL 1203 Certified Epoxy

Master Bond EP41S-6 is a new two component epoxy system that meets UL 1203, which is defined by Underwriters Laboratories as the “Standard for Explosion-Proof and Dust-Ignition-Proof Electrical Equipment for Use in Hazardous (Classified) Locations”. To meet the UL 1203 requirements, samples of EP41S-6 were exposed to saturated vapors in air for the following chemicals: acetic acid (glacial), acetone, ammonium hydroxide (20% by weight), ASTM reference fuel C, diethyl ether, ethyl acetate, ethylene dichloride, furfural, n-hexane, methyl ethyl ketone, methanol, 2-nitropropane, and toluene. After 168 hours of exposure to these vapors, sample castings in groups of 6 were observed for discoloration, swelling, shrinking, crazing, cracking, leaching, and dissolving. The samples were also subjected to a crush test before and after exposure to these chemicals. The crushing force for EP41S-6 was not less than 85% of the original value. EP41S-6 has successfully met or exceeded the requirements of these tests.
24th October 2018

Two component epoxy with thermal shock resistance

Two component epoxy with thermal shock resistance
Master Bond EP110F8-3 is a two part epoxy system ideal for sealing, encapsulating, potting, and casting applications. “This toughened system provides very good flexibility and possesses a relatively high elongation of 120-150%”, said Rohit Ramnath, Senior Product Engineer. “It offers a low tensile modulus of around 5,000-15,000 psi and a shore A hardness of 40-50 at room temperature."
10th September 2018

High tensile epoxy adhesive utilises renewable biomaterial

High tensile epoxy adhesive utilises renewable biomaterial
Master Bond EP70CN is a two part, thermally stable epoxy adhesive formulated using a natural, renewable and sustainable ingredient. This epoxy system forms high physical strength bonds and can be utilised for bonding, sealing, coating and potting. 
7th August 2018

Epoxy adhesive for structural bonding features long pot life

Epoxy adhesive for structural bonding features long pot life
Master Bond EP21ND-LP was created for structural bonding applications involving large surface areas. It has a long working life of 2-4 hours at 75°F for a 100g mass. Its smooth paste consistency makes it convenient to apply and use. Shore D hardness is 70-80 when mixed in a one to one mix ratio by weight or volume. Moreover, certain properties of the epoxy can be altered by adjusting the mix ratio.
23rd July 2018

Adhesive featuring low coefficient of thermal expansion

Adhesive featuring low coefficient of thermal expansion
It has been announced that Master Bond EP30LTE-2 has been developed for joining dissimilar substrates exposed to thermally or mechanically induced stresses. It can be used for sealing, coating and encapsulating, especially for small to medium sized castings where a very low coefficient of thermal expansion (CTE) is required. 
11th July 2018

Epoxy based dual curing adhesive

Epoxy based dual curing adhesive
Master Bond UV22DC80-10F is a single component, nanosilica filled compound featuring a UV and heat curing mechanism. This thixotropic, moderately low viscosity compound has a viscosity of 8,000-12,000 cps at 75°F (~ 23°C). It is said to provide outstanding dimensional stability and superior physical strength properties. Additionally, UV22DC80-10F is optically clear and offers the ability to be cured in shadowed out areas.
16th January 2018

Silicone compound offers low thermal resistance

Silicone compound offers low thermal resistance
Master Bond MasterSil 151TC was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. This 100% solids silicone compound features excellent thermal conductivity and superior electrical insulation properties. Volume resistivity is >1014 ohm-cm.
27th November 2017

Electrically conductive die attach adhesive

Electrically conductive die attach adhesive
Master Bond EP3HTSDA-1 is a single part, no mix epoxy adhesive designed primarily for die attach applications. It exhibits a die shear strength of 20-22 kg-f and has a high thermal conductivity. “This 100% solids formulation has an ideal viscosity and flow for die attach, will not ‘tail’ and can be easily dispensed automatically” says Rohit Ramnath, senior product engineer. “Additionally it has an unlimited working life at room temperature and will cure in 20-30 minutes at 250°F or 5-10 minutes at 300°F.”
4th November 2017

Epoxy features enhanced dimensional stability

Epoxy features enhanced dimensional stability
Developed by Master Bond for potting, sealing, encapsulation and casting applications, EP110F8-5 is dimensionally stable and has low shrinkage upon cure. This system is said to feature superior electrical insulation properties including a volume resistivity exceeding 1015 ohm-cm, a dielectric constant of 2.91 at 1 KHz and a dissipation factor of 0.009 at 1KHz.
9th October 2017

One component, high temperature resistant epoxy

One component, high temperature resistant epoxy
With a low coefficient of thermal expansion of 15-20 x 10-6 in/in/°C, Master Bond EP13LTE is a one part epoxy for structural bonding applications. According to Master Bond, EP13LTE cures readily in 1-2 hours at 300-350°F and has limited flow while curing. It is said to bond well to many substrates such as metals, glass, composites, ceramics and plastics. 
20th September 2017

Evaluating chemically resistant adhesives

Evaluating chemically resistant adhesives
Master Bond has published a  paper which offers a guide to evaluating and selecting adhesive products exposed to harsh chemical environments. It examines the importance of exposure variables, chemical interactions, testing and also includes practical suggestions of procedures on how to avoid generalities in the selection process.
22nd August 2017

One Component Elastomeric Primer/Adhesive System

One Component Elastomeric Primer/Adhesive System
Master Bond has developed X21Med for priming and bonding polyolefinic substrates. It is a single component elastomeric compound that passes ISO 10993-5 tests for cytotoxicity. According to Masterbond, this specialty system was designed to be used as a primer that would promote adhesion between polyolefins and other surfaces such as metals, ceramics, composites and other kinds of plastics. Surfaces primed with X21Med are compatible with a wide variety of adhesives and it can also be used to bond two polyolefin materials.
14th August 2017

Thermally conductive epoxy delivers low exotherm

Master Bond EP39MAOHT is a room temperature curing system which is said to be good for demanding bonding, sealing, coating, potting and encapsulation applications. According to the company it is a versatile product that combines convenient handing, good flow, thermal conductivity, electrical insulation and high temperature resistance.
21st July 2017

Rapid curing epoxy offers high bond strength

Master Bond EP41S-F is a two part epoxy for bonding, sealing, coating and encapsulation applications. It combines fast ambient temperature cure speed with chemical resistance and superior electrical insulation properties. This versatile system is easy to handle and has a forgiving 100 to 25 mix ratio by weight. After mixing, EP41S-F polymerizes quickly and can usually be removed from a fixture within 20-30 minutes. Full cures are achieved in 24 hours at 75°F or in 45-60 minutes at 200°F.
28th June 2017


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