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Master Bond Inc

Master Bond Inc Articles

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Medical
29th March 2016
Fast curing silicone in medical applications

Master Bond MasterSil 910Med is a one part acetoxy type silicone system that meets USP Class VI specifications for biocompatibility and ISO 10993-5 testing for cytotoxicity. This translucent paste also withstands many sterilisation methods, including liquid sterilants, gamma radiation and EtO.

Component Management
10th March 2016
Epoxy resists chemicals and abrasion as well as high temperature

Master Bond Supreme 45HTQ-4 is a toughened epoxy for high performance bonding, sealing, coating and casting and can be used for a wide variety of industrial, aerospace, OEM and oil processing applications, especially in downhole situations.

Component Management
2nd March 2016
Toughened one component epoxy for chip coating applications

Master Bond Supreme 3HTND-2CCM is a multifunctional epoxy that is well suited for chip coating, glob top and die attach applications as well as for bonding, sealing and encapsulation. Since it is a one part system, it does not require mixing and has an “unlimited” working life at room temperature. 

Component Management
1st February 2016
Non-yellowing UV curable system

Master Bond UV15X-6NM-2 is a one component UV curing urethane acrylate system and will be widely used for fiber-optic, optical, electronic, semiconductor, microelectronic and laser applications. It is formulated for a variety of bonding, sealing, coating and encapsulation applications.

Component Management
11th January 2016
Adhesive meets NASA low outgassing specs

Master Bond Supreme 18TC is a single component epoxy adhesive that contains a blend of special thermally conductive fillers which can be applied in bond lines as thin as 10-15 microns while offering an exceptionally low thermal resistance.

Component Management
15th December 2015
A long working life from Master Bond

Developed for high performance bonding and sealing applications, Master Bond Supreme 11HTLP is a two part epoxy that is already selected by the aerospace, electronics and specialty OEM industries. It combines easy processing with a profile that includes high physical strength.

Component Management
24th November 2015
Two-part silicone system meets NASA low outgassing specifications

Master Bond MasterSil 972TC-LO passes the requirements for low outgassing to ASTM E595 specifications and is particularly well suited for use in vacuum environments as well as applications in the aerospace, electronic, opto-electronic and specialty OEM industries.

Component Management
2nd November 2015
Epoxy Meets USP Class VI and ISO 10993-5

Master Bond UV15DC80Med has a dual curing mechanism which employs UV light followed by heat to complete the polymerization. This allows for curing areas on parts that do not allow UV light curing because of “shadowing” issues. This kind of UV system is highly desirable because it allows for rapid fixturing with completion of the cure accomplished by adding heat.

Component Management
14th October 2015
One component epoxy cures at 200-220°F

Formulated for potting, encapsulation, bonding and sealing applications, Master Bond EP17HT-100 is a single part epoxy system that is designed to cure in 60-90 minutes at 200-220°F. Cures can be accelerated at higher temperatures

Component Management
24th September 2015
One part fluorosilicone offers superior chemical resistance

With enhanced chemical resistance Master Bond MasterSil 930 is an acetoxy type fluorosilicone for bonding, sealing and coating applications in aerospace, electronics, specialty OEM and other industries. This one part system is able to withstand exposure to water, fuels, oils, greases, refrigerants, acids, bases and solvents better than standard silicones.

Component Management
1st September 2015
Epoxy paste cures optically clear in thin sections

Master Bond EP21NDCL is a unique two component epoxy system that cures optically clear in thin sections, even though Part A is translucent and Part B is light amber. This non-drip compound is formulated for a variety of bonding, sealing and coating applications in the optical, opto-electronic, electrical, aerospace and specialty OEM industries.

Component Management
10th August 2015
Epoxy is thermally conductive & electrically insulative

Developed for a variety of bonding, sealing, potting and encapsulation applications, Master Bond's EP3RR-80 is a one component epoxy that offers user friendly handling with a moderate viscosity, good flow properties and an unlimited working life at ambient temperatures. The epoxy system can be stored at 4.5-10°C and does not require freezing.

Component Management
22nd July 2015
Epoxy meets NASA low outgassing requirements

Widely used for applications in the aerospace, electronic and OEM industries, Master Bond EP121CL-LO is a high performance epoxy that passes ASTM E595 testing for NASA low outgassing specifications. This two component system has a low mixed viscosity of 1,000-3,000cps with a mix ratio of 100:80 by weight. It features an exceptionally long open time of at least 2-3 days at room temperature in a 100g batch and requires oven curing.

Component Management
1st July 2015
High strength epoxy targets structural bonding

Designed for high performance structural bonding in the aerospace and speciality OEM industries, Master Bond has announced the EP13SPND-2 one part, high temperature resistant epoxy. Featuring an impressive strength profile, EP13SPND-2 offers a tensile lap shear strength, compressive strength and tensile modulus of over 3,000, 18,000 and 500,000-550,000psi.

Component Management
8th June 2015
Neutral curing silicone formulated for medical devices

Designed for high performance bonding, sealing and coating applications for medical devices, MasterSil 912Med is a room temperature vulcanising silicone system. This system meets both USP biocompatibility and ISO cytotoxicity standards and resists a variety of sterilisation techniques such as gamma radiation, EtO and some types of liquid sterilants.

Component Management
27th May 2015
Epoxy polysulfide system features an elongation of 150-200%

An electrically insulative, two part epoxy polysulfide system with a thermal conductivity of 1.30-1.44 W/(m·K) has been introduced by Master Bond. As a polysulfide based system, the EP21TPFL-1AO has very good chemical resistance, particularly to fuels, oils, hydraulic fluids and related compounds. This unusual blend of properties makes the system suitable for a variety of bonding, sealing, coating and encapsulation applications in the elec...

Component Management
28th April 2015
Adhesive offers high strength & cryogenic serviceability

Combining simple handling properties with high strength, Master Bond Supreme 10HTF-1 is a single part adhesive/sealant for a variety of applications in the aerospace, electronic, optical, specialty OEM and related industries. At room temperature, this smooth paste system has an 'unlimited' working life and cures rapidly at elevated temperatures.

Component Management
7th April 2015
Two-part epoxy displays low thermal resistance

Featuring special high thermal conductive fillers, Master Bond EP48TC is two part epoxy paste that can be applied in bond lines as thin as 10-15μm. This material offers exceptionally low thermal resistance of 5-7 x 10-6 K•m2/W, which imparts impressive heat transfer capabilities and thermal conductivity of 2.88-3.60W/m·K, suitable for applications in the aerospace, optoelectronic and speciality OEM industries.

Component Management
17th March 2015
Sealing & coating silicone meets NASA requirements

Passing ASTM E595 testing for NASA low outgassing, MasterSil 920-LO is a high performance, room temperature vulcanising silicone for sealing, coating and small encapsulations. Introduced by Master Bond, this single component system has a moderate, flowable viscosity and a solid electrical profile, which makes it suited for conformal coating applications in the electronic and optical industries.

Component Management
23rd February 2015
Flame retardant epoxy targets aerospace industry

Developed for speciality aviation applications, a two part epoxy system has been introduced by Master Bond. EP90FR-V passes the vertical burn test portion of the FAR standard 14 CFR 25.853(a) for flame retardancy, which enables it to be used in aviation applications including interior panels, door frame lining and floor/door assemblies.

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