Nordson MARCH

Address:
Nordson MARCH - World Headquarters
2470-A Bates Avenue
Concord
California
94520-1294
United States of America

Phone: 925.827.1240

Fax: 925.827.1189

Web: http://www.nordson.com/en-us/divisions/march/pages/default.aspx


Nordson MARCH articles

Displaying 1 - 8 of 8

Plasma systems enable high processing for 3D and wafer-level assembly

Plasma systems enable high processing for 3D and wafer-level assembly
Nordson MARCH has introduced the MesoSPHERE Plasma System for very-high throughput processing of 3D and wafer-level packaging processes such as fan-in, fan-out, wafer-level, and panel-level -handling wafers up to 450mm and panels up to 480mm. The MesoSPHERE's new, patented W3 three-axis symmetrical plasma chamber ensures that all areas of the wafer are treated equally and uniformly. Tight control over all process parameters gives highly repeatable results.
5th February 2018

Plasma System Increases Machine Capacity

Nordson MARCH has introduced its ModVIA plasma system, a fully integrated, flexible system that doubles its capacity from 4 to 8 cells (8-16 panels) to easily accommodate manufacturing production growth. The ModVIA's compact design and small footprint save valuable floor space while delivering the same time-tested results and proven technology to treat printed circuit boards for desmear, etchback, and to provide surface activation, like other systems in the Nordson MARCH VIA family. 
5th May 2016

White Paper evaluates the effects of RF Plasma Processing Prior to Conformal Coating

Nordson MARCH has recently released a white paper showing the results of RF plasma processing on conformal coating adhesion, the conformity of the coating coverage, and the resulting effects on electrical functionality of a fully assembled printed circuit board. The research was done in conjunction with Nordson ASYMTEK, AirBorn Electronics, and SMART Microsystems (formerly known as Desich SMART Center). 
2nd March 2016


Plasma treatment system expands up to six chambers

Plasma treatment system expands up to six chambers
  Nordson MARCH announces that its StratoSPHERE Series plasma treatment equipment for wafer-level packaging and 3D packaging applications can now be configured in two, four, and even six chamber configurations for increased throughput and flexibility.
20th August 2015

Plasma systems for wafer-level and 3D packaging applications

Plasma systems for wafer-level and 3D packaging applications
Nordson MARCH announces its recent SPHERE series plasma systems for wafer-level and 3D packaging applications. Based on Nordson MARCH's TRAK Series, the series consists of the TrophoSPHERE and StratoSPHERE plasma treatment systems. The systems perform descum, ashing (photoresist/polymer stripping), dielectric etch, wafer bumping, organic contamination removal and wafer destress.
2nd July 2015

Plasma treatment of PCBs improves coating adhesion

Plasma treatment of PCBs improves coating adhesion
Nordson MARCH has revealed that recent studies have indicated that Printed Circuit Boards (PCBs) feature improved coating adhesion when plasma treated prior to conformal coating. Enhancing surface wettability, the plasma treatment improved adhesion of the conformal coating to high-performance solder mask materials and other difficult-to-adhere-to substrates.
1st July 2014

Plasma processing for flexible electronic PCBs & substrates

Plasma processing for flexible electronic PCBs & substrates
Enabling a rate of as much as 200 units per hour (UPH) for the manufacture of flexible electronic PCBs and substrates, Nordson MARCH introduces its FlexVIA-Plus Plasma Treatment System. The system delivers single-stage plasma processing - including etchback and desmear - of up to 30 panels (panel size 500x813mm or 20x32") per cycle.
29th May 2014

System for plasma treatment prior to die attach

System for plasma treatment prior to die attach
Offering double the capacity and throughput of its predecessor in just 16% more floor space, the FlexTRAK-CDS plasma system has been announced by Nordson MARCH. This high-volume, compact platform with strip processing capabilities is designed for plasma treatment prior to die attach, wire bond, mold encapsulation and underfill.
7th April 2014


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