Parker Hannifin

Gerard Young, Applications Engineering Team Leader, Parker Hannifin – Chomerics Division Europe, explains that 3D printing for prototyping EMI housings and gaskets is breaking new ground.

Parker Chomerics has released  THERM-A-GAP GEL, which is supplied as a pre-cured, single part thermal gel compound for dispensing over heat-generating electronic components. Said to offer an excellent price-to-performance ratio, THERM-A-GAP GEL45 is purpose-designed to eliminate time consuming hand assembly, decrease installation costs and reduce the complexity of customer manufacturing and purchasing functions.

Chomerics Europe has introduced THERM-A-GAP TPS60, a new thermal interface material with exceptional thermal conductivity and very low deflection force. Designed for effective heat dissipation in telecommunication, IT and automotive applications, THERM-A-GAP TPS60 comprises a soft (Shore 00-35) silicone matrix filled with thermally conductive particles. As a result, it demonstrates exceptional conformability as a putty-type material.

As more and more high performance electronics are utilised across a wide range of applications, there is a growing need to provide innovative thermal materials that can effectively manage heat dissipation challenges. In line with this need, Parker Chomerics is constantly evolving its range of THERM-A-GAP thermally conductive dispensing gels in order for customers to maintain both system performance and reliability.