Photo Stencil will showcase advanced stencils for printing the most demanding PCB and semiconductor packaging designs at IPC APEX 2016. Photo Stencil's technology focus has evolved with the industry and is now directed at the most advanced and challenging stencil applications.

Photo Stencil, LLC, a provider of high-performance stencils and tooling, has announced that Susan Holmes, the company's Vice President of Engineering and Customer Service, will present her Stencil Design for Wafer Level Ball Drop and Flip Chip Assembly at the Annual International Wafer-Level Packaging Conference during Session 10 on Wednesday 14th October.

Photo Stencil will present results of the paper '3D Electroform Stencils for Two-Level PCBs', on Wednesday 25th February at 10:00-10:30am and 4:30-5:00pm, in room 6A, IPC APEX Expo 2015, San Diego, California. The paper was written and will be presented by Rachel Miller-Short, Photo Stencil, in collaboration with William E. Coleman, Photo Stencil, Dudi Amir, Intel, and Joseph Perault, Parmi.

Photo Stencil has expanded its stencil manufacturing process with the addition of Laser Direct Imaging (LDI) capabilities. The new equipment enables Photo Stencil to transfer intricate patterns, fine lines, and small dots that are necessary for high density interconnects, BGAs, CSPs, and flex circuits, onto a substrate to create an extremely accurate stencil that can be used for solder paste printing of PCBs.

Photo Stencil, LLC announces that its step stencils are now available using Photo Stencil's unique new NiCut high-performance stencil technology that delivers the quality advantages of an electroform stencil, but with faster turn-around time. Step stencils offer significant flexibility in achieving the proper solder paste height and volume for the overall paste printing process, especially when trying to print on boards containing very small comp...